Adaptive Thermal Control for Electronic Devices
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Solution Overview
Problem
Traditional thermal control methods for electronic devices do not effectively adjust thermal parameters based on ambient air flow conditions or form factor mode, leading to suboptimal performance and heat dissipation.
Innovation Solution
An electronic device detects changes in ambient wind speed and form factor mode, determining a set of thermal control parameters using a lookup table or mathematical model to adjust power budget and performance settings, such as moving average power consumption, maximum operating frequency, and active cooling, to optimize heat dissipation and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional thermal control methods are used without adjusting for ambient air flow or form factor mode, then device simplicity is maintained, but thermal management effectiveness deteriorates
Solution Approach 1:
The patent implements dynamic thermal control by continuously monitoring ambient air flow conditions and form factor mode changes, then adjusting thermal parameters in real-time. The system transitions from static to dynamic control, adapting cooling strategies based on current environmental conditions and device configuration to optimize heat dissipation effectiveness.
Solution Approach 2:
The system changes thermal control parameters such as power budget allocations, processor frequency limits, and cooling activation thresholds based on detected ambient air flow conditions and form factor mode. By dynamically adjusting these parameters, the system optimizes thermal management effectiveness without requiring complex hardware modifications.
2Temperature
If thermal control parameters are adjusted based on ambient air flow and form factor mode, then heat dissipation effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent employs feedback mechanisms where sensors continuously monitor ambient air flow conditions and form factor mode, feed this information to the thermal control system, which then adjusts thermal parameters accordingly. This closed-loop feedback approach enables adaptive thermal management while keeping the control logic systematic and manageable.
Solution Approach 2:
The thermal control system automatically adjusts its own parameters based on sensor input without requiring manual intervention or complex external control systems. The device self-regulates thermal management by detecting environmental conditions and autonomously modifying power budget and cooling strategies, reducing overall system complexity.
3Productivity
If power budget is increased to improve performance, then computing performance is improved, but heat generation increases
Solution Approach 1:
The system dynamically changes power budget parameters based on ambient air flow conditions and form factor mode. When favorable cooling conditions are detected (higher air flow or optimal form factor), the system increases power budget to boost computing performance. When cooling conditions deteriorate, the system reduces power budget to control heat generation, maintaining performance optimization while managing thermal output.
Solution Approach 2:
The patent implements dynamic power management where the power budget is continuously adjusted based on real-time thermal conditions and environmental factors. This dynamic approach allows the system to maximize computing performance when thermal conditions permit while automatically reducing power consumption and heat generation when thermal headroom is limited.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This adaptive thermal control method enhances performance by leveraging ambient air flow and form factor changes, allowing for increased power budget and performance without exceeding skin temperature limits, thereby utilizing the device's cooling capabilities more effectively.
Implementation Method 1
The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor
Implementation Method 2
The cooling capability of an electronic device changes if the speed of ambient air flow (wind) to which the electronic device is exposed changes
Data Source
AI summary
A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.