Adaptive Thermal Resistance Controller for Component Temperature Management

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Solution Overview

Problem

Thermal management systems face challenges in efficiently managing temperature limits across components, leading to premature operation restrictions due to fixed thermal resistance and capacity, which can result in reduced performance and increased costs.

Innovation Solution

A controller adjusts the thermal resistance and capacity of a medium between components to delay the reaching of temperature limits, extending operational duration by dynamically managing thermal margins and resistance based on temperature differences and limits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Duration of action of moving object

If fixed thermal resistance and capacity are used in thermal management systems, then the system structure is simple, but the operational duration is reduced due to premature temperature limit reaching

Engineering Contradiction:
Improveoperational durationVSAvoidsystem complexity
Core Design Contradiction:
Duration of action of moving objectVSDevice complexity

Solution Approach 1:

The patent applies dynamics by making the thermal resistance and thermal capacity adjustable rather than fixed. The controller dynamically modifies these parameters based on real-time temperature monitoring of multiple components, allowing the thermal management system to adapt its behavior to changing thermal conditions and extend operational duration before temperature limits are reached.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by varying the thermal resistance and thermal capacity values according to the thermal states of different components. The controller adjusts these parameters based on temperature differences and thermal margins, enabling the system to optimize heat transfer paths and delay temperature limit reaching, thereby extending operational duration.

Inventive Principle:
Principle #35Parameter changes

2Duration of action of moving object

If additional cooling components are added to extend operational duration, then the operational duration is improved, but the manufacturing cost increases

Engineering Contradiction:
Improveoperational durationVSAvoidmanufacturing cost
Core Design Contradiction:
Duration of action of moving objectVSEase of manufacture

Solution Approach 1:

The patent uses parameter changes to adjust thermal resistance and capacity values through control signals, eliminating the need for additional physical cooling components. By dynamically modifying these thermal parameters based on component temperature states, the system extends operational duration using software/control-based solutions rather than hardware additions, thereby reducing manufacturing costs.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces mechanical/physical cooling components with a control-based thermal management approach. Instead of adding more heat sinks, fans, or thermal interface materials, the system uses a controller to adjust thermal parameters electronically, substituting a mechanical solution with a control-system solution that reduces manufacturing complexity and cost.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If fixed thermal resistance is used, then the device complexity is low, but the performance is reduced due to premature operation restrictions

Engineering Contradiction:
ImproveperformanceVSAvoidcontrol complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies dynamics by implementing adjustable thermal resistance that responds to real-time temperature conditions. The controller continuously monitors component temperatures and dynamically modifies thermal resistance values to optimize heat transfer, allowing the system to maintain higher performance levels for longer periods without premature operation restrictions, despite the increased control complexity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements feedback by using temperature sensor data from multiple components to control the adjustment of thermal resistance. The controller receives temperature information, compares it against thermal margins and limits, and adjusts thermal resistance accordingly, creating a closed-loop system that optimizes performance while preventing temperature limit violations.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively extends the operational duration of components by optimizing thermal management, reducing the need for additional cooling components and lowering manufacturing costs while maintaining performance.

Implementation Method 1

a first medium between the first component and the second component and having a first thermal resistance

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a second component thermally coupled to the first component, the second component having a second temperature limit and a variable thermal capacity

Methodology Applied
Scientific EffectThermal capacity: Thermal Energy Storage

Data Source

PatentUS10852080B2Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity
Publication Date: 2020.12.01 SAMSUNG ELECTRONICS CO LTD
  • US10852080B2 patent drawing
  • US10852080B2 patent drawing
  • US10852080B2 patent drawing

AI summary

A controller configured to: acquire a temperature of a first component and a temperature of a second component; and adjust a thermal resistance of a medium between the first component and the second component based on the acquired temperature of the first component, the acquired temperature of the second component, a first temperature limit of the first component, and a second temperature limit of the second component.