Adaptive Via Footprint Adjustment for Panelized Semiconductor Packaging
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Solution Overview
Problem
In semiconductor device manufacturing, panelized packaging processes often result in misalignment of semiconductor die during the overmolding and mounting processes, leading to defective packages and increased yield loss due to the displacement and rotation of semiconductor die, which affects the quality and reliability of the final product.
Innovation Solution
The method involves forming a panel with an encapsulating material around semiconductor die, measuring their actual positions, and adjusting the nominal footprint of conductive vias to account for misalignment by forming capture pads and modifying the shape or size of the vias to ensure proper alignment and connection, even when the die are not in their nominal positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If panelized packaging processes are used to increase productivity, then manufacturing efficiency is improved, but misalignment of semiconductor die occurs leading to decreased manufacturing precision
Solution Approach 1:
The patent applies preliminary action by forming capture pads and adjusting via footprints before the actual die placement and overmolding processes. The nominal footprint of conductive vias is modified in advance to account for expected misalignment, and capture pads are positioned to accommodate die displacement. This preparatory configuration enables the process to tolerate alignment variations while maintaining connection reliability.
Solution Approach 2:
The patent changes geometric parameters of the conductive vias by adjusting their nominal footprint to create modified footprints with larger dimensions. This parameter modification allows the vias to compensate for die misalignment by providing a larger target area for electrical connections, thereby maintaining manufacturing precision despite variations in die positioning during panelized packaging.
2Area of stationary object
If smaller bond pad openings are used to increase packaging density, then area is reduced, but alignment tolerance decreases leading to increased defect rate
Solution Approach 1:
The patent applies local quality by creating non-uniform via footprints where the conductive via structure has enlarged dimensions specifically at the connection interface with the bond pad. The modified via footprint provides localized area expansion at the critical connection point while maintaining smaller overall package dimensions, thus simultaneously achieving high density and reliable connections.
3Manufacturing precision
If adaptive patterning with dynamic via clipping is implemented to improve alignment, then manufacturing complexity increases, but yield is improved
Solution Approach 1:
The adaptive patterning process uses preliminary action by pre-calculating and pre-adjusting the via footprint dimensions based on expected misalignment scenarios. The nominal footprint is modified in advance to create a robust design that accommodates variation, eliminating the need for complex real-time adjustments during manufacturing while maintaining high alignment precision.
Data Source
AI summary
A semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping is described. A panel comprising an encapsulating material disposed around a plurality of semiconductor die can be formed. An actual position for each of the plurality of semiconductor die within the panel can be measured. A conductive redistribution layer (RDL) comprising first capture pads aligned with the actual positions of each of the plurality of semiconductor die can be formed. A plurality of second capture pads at least partially disposed over the first capture pads and aligned with a package outline for each of the plurality of semiconductor packages can be formed. A nominal footprint of a plurality of conductive vias can be adjusted to account for a misalignment between each semiconductor die and its corresponding package outline.