Semiconductor Feature Imaging for Adaptive 3D Reconstruction Capture
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Solution Overview
Problem
Conventional wafer inspection systems (WIS) face challenges in obtaining effective 3D reconstruction of features on semiconductor substrates due to suboptimal image capture methods, leading to incomplete or inaccurate 3D reconstructions and reduced throughput.
Innovation Solution
The method involves automatically adjusting camera settings and filtering the images included in the stack of images to ensure that only "good" images are used for reconstruction and dynamically determining when enough images have been captured for 3D reconstruction, while optimizing parameters such as illumination intensity, shape, and focus height to improve image quality and throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional WIS modules capture a predetermined number of images at predetermined locations using fixed camera settings, then the inspection process is simple to operate, but the 3D reconstruction accuracy deteriorates because images may not capture the feature well or add useful information
Solution Approach 1:
The system dynamically adjusts camera parameters (illumination intensity, shape, focus height) during the image capture process based on real-time analysis of captured images, rather than using fixed predetermined settings. This allows the inspection system to adapt to different feature characteristics and optimize image quality for 3D reconstruction.
Solution Approach 2:
The inspection system automatically analyzes captured images and self-adjusts camera parameters without requiring external intervention. The system evaluates image quality metrics and autonomously modifies illumination and focus settings to optimize the capture of useful feature information.
2Measurement precision
If the camera system captures more images at more locations to improve 3D reconstruction, then the reconstruction accuracy improves, but the inspection time and throughput worsen
Solution Approach 1:
The system implements a feedback mechanism where each captured image is analyzed to determine its contribution to 3D reconstruction. Based on this feedback, the system decides whether to capture additional images or proceed with reconstruction, optimizing the balance between image quality and inspection speed.
Solution Approach 2:
The system captures images selectively rather than uniformly. It stops capturing images once sufficient information for accurate 3D reconstruction is obtained, avoiding the excessive action of capturing a fixed predetermined number of images regardless of actual need.
3Measurement precision
If camera parameters are manually optimized for each inspection case, then the image quality improves, but the ease of operation deteriorates due to increased complexity
Solution Approach 1:
The inspection system performs self-optimization of camera parameters by automatically analyzing captured images and adjusting illumination intensity, shape, and focus height without requiring manual intervention. This maintains high image quality while preserving operational simplicity.
Solution Approach 2:
The system performs preliminary analysis of captured images to determine optimal parameter settings before proceeding with the full inspection sequence, ensuring high image quality from the start without requiring manual pre-adjustment for each case.
Data Source
AI summary
Embodiments of systems and methods are disclosed for inspecting features formed within and/or on a semiconductor substrate. More specifically, the present disclosure provides various embodiments of systems and methods to automatically adjust one or more parameters (or camera settings) used by a camera system to capture a stack of images of a feature formed within and/or on a semiconductor substrate before the images are processed to generate a three-dimensional (3D) reconstruction of the feature. In some embodiments, the disclosed systems and methods may filter the images included within the stack of images used for 3D reconstruction and dynamically determine when the camera system has captured enough images for 3D reconstruction of the feature. In doing so, the disclosed systems and methods may provide a more complete and accurate 3D reconstruction of the feature, while improving throughput of the wafer inspection process.