Adaptive Wiring Layout for Component Placement Offsets

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Solution Overview

Problem

Existing microlithography systems face challenges in accurately placing components within defined areas, leading to misalignment and inefficiencies in wiring connections, which impacts the economic viability and throughput of semiconductor and display device manufacturing.

Innovation Solution

A method that uses design and field-measured data to adjust wiring connections based on actual component placement, employing scanning devices to determine offsets and augmenting connection patterns to ensure accurate alignment and adapt to slight deviations during processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If fixed static wiring connections are used from periphery to component, then wiring alignment is simplified, but component misalignment during processing causes wiring misalignment and defects

Engineering Contradiction:

Improvewiring connection systemVSAvoidcomponent placement accuracy

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent applies dynamics by transitioning from fixed static wiring connections to dynamic adaptive wiring connections. The system scans the actual component position, determines offset data from the intended position, and dynamically adjusts the wiring connection pattern accordingly. This allows the wiring system to adapt to component position variations during processing, resolving the contradiction between simplified wiring design and manufacturing precision requirements.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If strict component placement control is implemented to prevent misalignment, then wiring alignment accuracy is improved, but processing throughput and economic viability decrease

Engineering Contradiction:

Improvecomponent placement accuracyVSAvoidprocessing throughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent implements feedback by scanning the actual component position during processing, comparing it to the intended position, and using the offset data to adjust the wiring connection pattern. This closed-loop feedback system allows the process to accommodate placement variations without requiring strict control measures, thereby maintaining precision while improving throughput and economic viability.

Inventive Principle:

Principle #23Feedback

3Productivity

If maskless microlithography is used for rapid processing, then throughput increases, but adaptation to actual component positions becomes more challenging

Engineering Contradiction:

Improveprocessing throughputVSAvoidadaptation to component position variations

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent applies preliminary action by scanning and determining the actual component position and offset data before generating the final wiring connection pattern. This preparatory step enables the maskless microlithography system to adapt to actual component positions efficiently, maintaining both high throughput and adaptability by preparing the corrected pattern data in advance of the actual wiring deposition process.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12360467B2Dynamic generation of layout adaptive packaging

Publication Date: 2025.07.15 APPLIED MATERIALS INC

AI summary

Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.