Add-in Module Dual-Side Thermal Management
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Solution Overview
Problem
Conventional add-in modules with a single heat sink on one side face challenges in dissipating heat from chips on both sides, leading to overheating and reliability issues due to inadequate thermal connectivity.
Innovation Solution
The add-in module incorporates a heat sink on one substrate surface and a heat-dissipation plate on the opposing surface, both thermally connected to respective heat sources via conductive elements, with fasteners securing the components to prevent interference and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single heat sink is used on one side of the add-in module, then the heat sink does not interfere with adjacent electronic elements, but the chips on the other side cannot be effectively cooled
Solution Approach 1:
The heat dissipation function is segmented into two independent components: a heat sink for the first substrate surface and a heat-dissipation plate for the second substrate surface. Each component independently manages heat from chips on its respective side, allowing effective cooling of all chips without requiring a single complex heat dissipation structure that would interfere with adjacent elements.
2Productivity
If chips are disposed on both sides of the add-in module to increase functionality, then the processing power and storage capacity are improved, but the heat generation increases and reliability deteriorates
Solution Approach 1:
The heat dissipation solution transitions from a single-sided approach to a dual-sided approach by adding the heat-dissipation plate on the second substrate surface. This dimensional expansion allows heat to be dissipated from both sides of the add-in module simultaneously, matching the dual-sided chip configuration and enabling effective thermal management for high-density chip arrangements.
3Length of stationary object
If the heat-dissipation plate is made thin to avoid interference with adjacent elements, then the space for adjacent elements is preserved, but the heat conduction capability may be reduced
Solution Approach 1:
The heat-dissipation plate is constructed from high-thermal-conductivity materials such as copper or aluminum, which compensate for the reduced heat conduction path length caused by the thin profile. These composite materials provide superior thermal conductivity per unit thickness, enabling effective heat transfer from chips to the surrounding environment even with minimal plate thickness, thus avoiding interference with adjacent elements while maintaining heat conduction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat from both sides of the module, preventing overheating and improving reliability while allowing the heat-dissipation plate to be thin and non-interfering with adjacent elements.
Implementation Method 1
The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources... The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources
Data Source
AI summary
An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.