Additive Cable Connector Assembly for Low-Loss IC Interconnects
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Solution Overview
Problem
Current electrical interconnect solutions for high-data-rate applications are costly and power-demanding, with traditional electrical connections becoming expensive and inefficient for short to medium distances, while optical solutions incur a power and cost penalty, and existing cable connectors face challenges with high-speed and power signal transmission due to resistive and parasitic paths.
Innovation Solution
The use of additive manufacturing processes, such as coldspray, to fabricate cable connectors directly on electronic substrates and fuse seams between cables and connectors, providing reliable and low-resistance electrical contact, and forming additive support structures for improved mechanical and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical connections are used for short to medium distances, then data transmission is achieved, but cost and power consumption increase significantly
Solution Approach 1:
The patent replaces traditional mechanical electrical connections with an additive manufacturing process that creates direct material bonds between cable components. This substitution eliminates the need for conventional connectors and wiring harnesses, reducing power consumption while maintaining data transmission reliability through direct material fusion.
Solution Approach 2:
The invention changes the fundamental parameters of connection by using additive manufacturing to create bonds with significantly lower resistance and parasitic effects compared to traditional electrical connections. This parameter change enables efficient power and data transmission without the losses inherent in conventional connector-based systems.
2Length of stationary object
If optical solutions are used for long distances, then reach and bandwidth are improved, but power consumption and cost increase
Solution Approach 1:
The patent replaces optical connector systems with an additive manufacturing approach that creates direct material bonds. This substitution maintains the ability to achieve long transmission distances while eliminating the power consumption penalties associated with optical connectors and associated signal conditioning equipment.
3Speed
If cable connectors are used for high-speed signal transmission, then data rates are achieved, but resistive and parasitic effects increase
Solution Approach 1:
The invention replaces mechanical cable connectors with additive manufacturing processes that create direct material bonds between cable components. This substitution eliminates the resistive and parasitic effects inherent in conventional connectors, enabling high-speed signal transmission with minimal energy loss through direct material fusion.
4Manufacturing precision
If CNC milling is used to fabricate cable connectors, then precision is achieved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent replaces CNC milling processes with additive manufacturing technology. This substitution maintains manufacturing precision through controlled material deposition and fusion while dramatically reducing manufacturing cost and complexity by eliminating tooling requirements, setup time, and post-processing operations associated with subtractive manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the need for costly CNC milling, enhances ground continuity and electromagnetic interference reduction, improves power efficiency, and supports high-speed and high-frequency connections with reduced latency and insertion loss.
Implementation Method 1
The use of additive manufacturing processes, such as coldspray, to fabricate cable connectors directly on electronic substrates
Implementation Method 2
additive manufacturing processes, such as coldspray, to fabricate cable connectors directly on electronic substrates and fuse seams between cables and connectors
Data Source
AI summary
Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.