Additive Cable Connector Structures for Low-Resistance IC Assembly Links
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Solution Overview
Problem
Current electrical interconnect solutions for high-data-rate applications are costly and power-demanding, with traditional electrical connections becoming expensive and inefficient for short to medium distances, while optical solutions incur a power and cost penalty, and existing cable connectors face challenges with high-speed and power signal transmission due to resistive and parasitic paths.
Innovation Solution
The use of additive manufacturing processes, such as coldspray, to fabricate cable connectors directly on electronic substrates and fuse seams between cables and connectors, providing reliable and low-resistance electrical contact, and forming additive support structures for improved mechanical and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional electrical cable connections are used for short to medium distances, then data transmission is achieved, but power consumption and cost increase significantly
Solution Approach 1:
The patent segments the interconnection system into multiple components: additive制造的connector, cable assembly, and receiver interface. This segmentation allows optimization of each component for specific functions, reducing overall power consumption while maintaining reliable data transmission through specialized design of each segment
Solution Approach 2:
The patent changes key parameters including using high-conductivity materials to reduce resistance, optimizing connector geometry to minimize parasitic effects, and selecting appropriate cable characteristics. These parameter changes reduce power consumption while maintaining transmission reliability
2Reliability
If optical fiber solutions are used for long distances, then data transmission capability improves, but power consumption and cost increase
Solution Approach 1:
The patent changes material parameters by using high-conductivity metals and optimizing geometric parameters to reduce resistance and parasitic effects. These parameter changes enable electrical connections to achieve performance previously only attainable with optical solutions, reducing power consumption while maintaining transmission capability
Solution Approach 2:
The patent substitutes mechanical/optical transmission systems with improved electrical transmission systems. By using additive manufacturing to create low-resistance electrical paths, the system replaces the need for optical fibers in short to medium distance applications, reducing power consumption while maintaining data transmission reliability
3Reliability
If large number of pins and complex sockets are used for power and HSIO connections, then connection capability improves, but device complexity and cost increase
Solution Approach 1:
The patent merges multiple functions into the cable assembly and connector, including power delivery, high-speed data transmission, and mechanical support. This consolidation reduces the need for complex sockets with numerous individual pins, simplifying the overall connection system while maintaining comprehensive connection capability
Solution Approach 2:
The cable assembly is designed as a universal interface that handles multiple functions simultaneously: power delivery through high-conductivity paths, high-speed data transmission through optimized signal paths, and mechanical support. This multi-functionality reduces device complexity by eliminating the need for separate specialized connections
4Adaptability or versatility
If signals travel through multiple material layers and socket pins, then connection flexibility improves, but power efficiency decreases due to resistive and parasitic paths
Solution Approach 1:
The patent changes material parameters by using high-conductivity materials and optimizing geometric parameters to minimize resistance and parasitic effects. The additive制造的connector creates direct, short electrical paths that reduce the number of material layers signals must traverse, improving power efficiency while maintaining connection flexibility through the cable assembly design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the need for complex and costly sockets, enhances power efficiency, and improves high-speed channel link budgets by achieving reliable and low-ohmic contact between components, while also providing mechanical rigidity and stress relief, thus addressing the limitations of traditional interconnect solutions.
Implementation Method 1
additive manufacturing processes, such as coldspray, to fabricate cable connectors directly on electronic substrates
Implementation Method 2
additive manufacturing processes, such as coldspray, to fabricate cable connectors directly on electronic substrates
Data Source
AI summary
Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.