Additive Circuit Carrier Smoothing for Fine Conductor Paths

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current methods for manufacturing circuit carriers, especially three-dimensional ones, face challenges such as high costs and limited design flexibility with injection molding, and additive manufacturing processes result in rough surfaces and coarse conductor path detailing, making them unsuitable for small batch production and precise applications.

Innovation Solution

A method involving additive manufacturing with a plastic material containing metal particles, where a smoothing agent is applied to enclose metal particles on the surface, allowing for precise conductor path generation through laser activation and metallization, reducing surface roughness and preventing tramp metallization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If additive manufacturing processes are used to produce circuit carriers, then production costs for small batches are reduced and design flexibility is improved, but surface roughness increases and conductor path precision deteriorates

Engineering Contradiction:

Improveproduction cost for small batchesVSAvoidconductor path precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies a preliminary smoothing treatment to the base body surface before conductor path generation. This preliminary action removes the roughness inherent in additive manufacturing, creating a smooth surface that enables subsequent precise conductor path formation with fine detailing capability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary smoothing treatment process between the additive manufacturing step and the conductor path generation step. This intermediary process acts as a mediator that transforms the rough additive manufactured surface into a smooth surface suitable for precise conductor path formation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If additive manufacturing processes are used to produce circuit carriers, then individualized mass production and high component complexity are enabled, but surface quality deteriorates and grinding processing becomes difficult

Engineering Contradiction:

Improveindividualized mass production capabilityVSAvoidsurface quality

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical grinding processes with a chemical or thermal smoothing treatment. This substitution eliminates the limitations of grinding on complex geometries while achieving the desired surface quality, allowing individualized mass production of highly complex components without surface quality deterioration.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the surface treatment approach from mechanical removal (grinding) to a different physical or chemical process that can access complex geometries. This parameter change enables effective surface smoothing on highly complex components that would be inaccessible to traditional grinding tools.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If conductor paths are applied to additively manufactured circuit carriers without surface treatment, then production time is reduced, but conductor path detailing precision is limited to coarse dimensions

Engineering Contradiction:

Improveproduction timeVSAvoidconductor path detailing precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies a partial smoothing treatment that is sufficient to enable fine conductor path detailing but not so extensive as to significantly increase production time. The smoothing is applied only to the extent necessary to achieve the required conductor path precision, balancing productivity and precision requirements.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of circuit carriers with improved surface quality and finer conductor paths, suitable for small batch production and precise applications, reducing the risk of short circuits and allowing for more complex designs.

Implementation Method 1

a smoothing agent dissolving the plastic material is applied to the base body surface

Methodology Applied

Scientific EffectDissolution: Solvation

Implementation Method 2

conductor paths are generated on the base body surface by means of laser activation and metallization

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS20240397630A1Process for producing an interconnect device for electronic and/or mechatronic components and interconnect device

Publication Date: 2024.11.28 FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV

AI summary

The invention relates to a method for manufacturing a circuit carrier (1) for electronic and/or mechatronic components, a circuit carrier for electronic and/or mechatronic components and a circuit. In particular, the invention relates to a method for producing a circuit carrier (1) for electronic and/or mechatronic components, comprising the steps of producing a base body (2) using an additive manufacturing method, the base body (2) having or consisting of a plastic material (8) with metal particles (10), applying a smoothing means which dissolves the plastic material (8) to a base body surface (3) of the base body (2) so that the base body surface (3) is substantially free of metal particles (10), and producing at least one conductor path (12, 18) on the base body surface (3).