Additive Conductor Redistribution Layer for IC Packages
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Solution Overview
Problem
Modern integrated circuit (IC) packages face challenges in cost-effective redistribution of connection points due to the need for specialized equipment and potential introduction of parasitic capacitance or inductance from thick conductive materials in redistribution layers, which complicates integration into both handheld and larger systems.
Innovation Solution
A process involving a carrier layer with a first plate-able layer to support selectively plated redistribution paths, allowing connection points to be relocated by forming fine geometries without specialized equipment, and subsequent removal of the carrier layer to expose redistribution paths, thereby reducing operational impact and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional redistribution layers with thick conductive materials are used, then connection points can be redistributed, but parasitic capacitance or inductance is introduced into the system
Solution Approach 1:
The patent changes the thickness parameter of the conductive material from thick (traditional) to thin (micrometer or sub-micrometer scale) by using additive manufacturing processes. This parameter change reduces parasitic capacitance and inductance while maintaining electrical connectivity for redistribution layer functionality.
Solution Approach 2:
The patent replaces traditional subtractive manufacturing methods (etching, drilling) with additive manufacturing (directed energy deposition, selective laser melting). This substitution enables precise control of conductor thickness and geometry, achieving minimal conductor thickness without specialized equipment while reducing parasitic effects.
2Manufacturing precision
If specialized equipment is used to produce redistribution layers, then fine geometries can be achieved, but system cost increases
Solution Approach 1:
The patent employs consumable powder or wire feedstock materials that are deposited and consumed during the additive manufacturing process. These inexpensive consumables replace expensive specialized equipment while achieving fine geometries through digitally controlled deposition processes.
Solution Approach 2:
The additive manufacturing process inherently provides its own precision control through digital modeling and automated deposition. The system self-regulates conductor geometry and thickness without requiring external specialized equipment, reducing overall device complexity while maintaining manufacturing precision.
3Volume of moving object
If IC package size is reduced for handheld devices, then space is saved, but connection points require more resources to connect to substrate
Solution Approach 1:
The patent uses additive manufacturing to create three-dimensional redistribution paths with controlled thickness and geometry. This dimensional control allows connection points to be redistributed in complex spatial arrangements within the minimized IC package volume, facilitating integration without increasing package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables low-cost formation of redistribution layers with minimal conductor thickness, facilitating integration of IC packages into systems while minimizing parasitic effects, thus addressing the complexity and expense issues associated with existing methods.
Implementation Method 1
The first plate-able layer is selectively plated to form one or more redistribution paths
Data Source
AI summary
A first plate-able layer is selectively plated to form one or more redistribution paths. The connection points of an IC package are connected to the redistribution paths, and the IC package is over molded for stability. The first plate-able layer is then removed, leaving the one or more redistribution paths exposed. The redistribution paths allow one or more contact points of the IC package to be moved to a new location in order to facilitate integration of the IC package into a system. By plating the redistribution paths up from the first plate-able layer, fine geometries for repositioning the contact points of the IC package with minimal conductor thickness are achieved without the need for specialized manufacturing equipment. Accordingly, a redistribution layer is formed at a low cost while minimizing the impact of the layer on the operation of the IC device.