Additive Electrical Device Manufacturing With In-Stage Process Transfer
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Solution Overview
Problem
Existing additive manufacturing processes for electrical devices require frequent removal and repositioning of three-dimensional articles during the manufacturing of multilayer wiring boards and electronic component mounting, leading to inefficiencies and increased production time.
Innovation Solution
A manufacturing apparatus with a stage that moves in orthogonal directions, incorporating shaping and mounting units capable of droplet ejection, allows for sequential movement along a path determined by the work process, enabling continuous additive manufacturing without the need for intermediate repositioning of the workpiece.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the three-dimensional article is removed from the printing device during each work process (insulating layer shaping, wiring pattern shaping, electronic component mounting), then each process can be performed by dedicated equipment, but the work process transition time increases and the manufacturing efficiency decreases
Solution Approach 1:
The patent combines the printing device and mounting machine into a single integrated apparatus. The printing unit and mounting unit are disposed within the movement range of the stage, allowing both insulating layer shaping, wiring pattern shaping, and electronic component mounting to be performed without removing the three-dimensional article from the device. This merging eliminates transfer time and maintains process quality through dedicated functional units.
Solution Approach 2:
The stage serves multiple functions by being capable of moving to different working positions within the apparatus. The same stage that holds the three-dimensional article during printing also positions it for electronic component mounting, eliminating the need for separate handling and repositioning operations between processes.
2Ease of manufacture
If the three-dimensional article is transferred between different devices during manufacturing processes, then each process can be optimized with specialized equipment, but the article requires rearrangement and repositioning which reduces manufacturing efficiency
Solution Approach 1:
The patent merges specialized printing and mounting functions into a single apparatus. The printing unit with laser beam for insulating layer and wiring pattern shaping, and the mounting unit for electronic component attachment, coexist within one device that shares a common stage and control system, maintaining process specialization while eliminating transfer operations.
Solution Approach 2:
The patent arranges the printing unit and mounting unit in different spatial positions within the apparatus, with both units disposed within the movement range of the stage. This spatial arrangement allows the stage to access different working positions sequentially without requiring article removal or complex repositioning, effectively utilizing three-dimensional space to optimize workflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the time required for work process transitions, allows for compact apparatus design, and enhances the versatility of the manufacturing process by enabling the simultaneous shaping of wiring patterns and insulating layers, as well as electronic component mounting, thereby improving the efficiency and speed of electrical device production.
Implementation Method 1
This flat plate-shaped material is melted by being exposed to laser light, and solidifies with time to become a layered article
Implementation Method 2
The manufacturing apparatus joins the new portion to the already-shaped portion by exposing the stacked flat plate-shaped material member to laser light to cause the flat plate-shaped material member to melt and subsequently solidify
Data Source
AI summary
A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.