Additive Grid Joining of Metal-Ceramic Interfaces Under Thermal Stress
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Solution Overview
Problem
Joining dissimilar materials like metals and ceramics in turbomachine components, such as gas turbines, is challenging due to thermal expansion mismatches, leading to mechanical, thermal, and thermomechanical stresses that can cause cracks, detachment, and reduced strength, especially in high-thermal-load applications, and existing buffer layers have limitations in oxidation resistance and producibility.
Innovation Solution
A method involving a lattice structure within the metallic material, produced via additive manufacturing, allows for direct joining of ceramic and metallic components without intermediate layers, compensating for thermal expansion stresses and enhancing temperature resistance and oxidation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If intermediate buffer layers are used to join dissimilar materials, then thermal expansion stress compensation is improved, but oxidation resistance deteriorates
Solution Approach 1:
The patent removes the intermediate buffer layer from the joining structure entirely. Instead of using copper, silver, or titanium buffer layers that provide stress compensation but suffer from oxidation resistance issues, the invention directly joins dissimilar materials through surface preparation and controlled joining processes, eliminating the oxidation vulnerability associated with intermediate layers.
Solution Approach 2:
The patent changes the joining parameters by using surface treatment methods (such as blasting, chemical etching, or plasma treatment) and controlled joining temperatures to directly achieve stress compensation without intermediate layers. The surface roughness, chemical composition, and thermal parameters are optimized to enable direct bonding while managing thermal expansion differences.
2Stress or pressure
If intermediate buffer layers are used to join dissimilar materials, then thermal expansion stress compensation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent eliminates the intermediate buffer layer from the manufacturing process, reducing the number of production steps. Instead of separately manufacturing and assembling buffer layers, the invention integrates stress management into the direct joining process through surface preparation and controlled joining parameters, simplifying the overall manufacturing workflow.
Solution Approach 2:
The patent combines the functions of surface preparation, stress management, and material joining into a single integrated process. By merging these previously separate steps (buffer layer fabrication, assembly, and joining) into one direct joining operation, the manufacturing complexity is reduced while maintaining stress compensation through optimized surface and process parameters.
3Stress or pressure
If intermediate buffer layers are used to join dissimilar materials, then thermal expansion stress compensation is improved, but contamination risk increases
Solution Approach 1:
The patent removes the intermediate buffer layer that acts as a potential contamination source. By eliminating this additional material interface, the invention reduces the risk of contamination from buffer layer materials, impurities in the buffer layers, or contamination introduced during buffer layer manufacturing and assembly operations.
4Stress or pressure
If buffer layers with low oxidation resistance are used, then thermal expansion compensation is improved, but temperature resistance deteriorates
Solution Approach 1:
The patent eliminates the use of oxidation-prone buffer layers (copper, silver, titanium) that limit temperature resistance. By removing these intermediate layers and implementing direct joining with optimized surface treatment and controlled atmospheric conditions, the system achieves both thermal expansion compensation and high temperature resistance without the constraints imposed by buffer layer material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces stresses and improves the strength and thermal resistance of composite materials by eliminating the need for intermediate layers, ensuring reliable operation under high thermal loads without introducing impurities or compromising oxidation resistance.
Implementation Method 1
stresses often occur in the area of the connection point (soldering point) due to different thermal expansion behavior or thermal expansion coefficients of the two materials
Implementation Method 2
These layers at least partially compensate for the described thermally induced different expansions of the joining components, for example through elastic and/or plastic deformation
Implementation Method 3
These layers at least partially compensate for the described thermally induced different expansions of the joining components, for example through elastic and/or plastic deformation
Implementation Method 4
A method involving a lattice structure within the metallic material, produced via additive manufacturing
Data Source
Figure 1~3
Figure 4~7
AI summary
The invention relates to a method for joining materials, comprising: providing a first material (W1) and a second material (W2), providing the first material (W1) with a grid structure (GS) at a joining point (VS), and joining, in particular soldering, the second material (W2) to the grid structure (GS) such that a material composite (10) of the first material (W1) and the second material (W2) is produced, wherein the grid structure (GS) is designed in such a way that stresses in the material composite (10) are at least partly compensated by the grid structure (GS).