Additive Heat Sink Reference Surfaces for Precision Assembly
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Solution Overview
Problem
Current heat sink manufacturing processes for semiconductor devices are inefficient and costly due to the use of subtractive methods, which require oversized components and complex milling processes to achieve dimensional accuracy for reference surfaces.
Innovation Solution
The heat sink is produced using an additive manufacturing process to create undersized reference surfaces, eliminating the need for subtractive processes and allowing precise elevation of necessary surfaces, such as those for attaching covers and DCB substrates, using materials like aluminum or copper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a subtractive manufacturing process is used to manufacture heat sinks with oversize, then dimensional accuracy can be achieved, but manufacturing costs increase due to milling processes and material waste
Solution Approach 1:
Instead of manufacturing the heat sink with oversize and then removing material through subtractive processes, the patent applies additive manufacturing to build the heat sink directly to the final desired dimensions. This inverts the traditional manufacturing approach, eliminating the need for milling and material removal while achieving the required dimensional accuracy for reference surfaces
Solution Approach 2:
The patent changes the manufacturing parameter from subtractive material removal to additive material deposition. By using additive manufacturing processes, the heat sink is built layer by layer to precise dimensions, transforming the manufacturing approach from removing excess material to depositing material only where needed, thereby eliminating milling costs and material waste
2Ease of manufacture
If additive manufacturing is used to raise reference surfaces, then manufacturing costs are reduced, but the complexity of controlling surface elevation precision increases
Solution Approach 1:
The patent incorporates feedback mechanisms in the additive manufacturing process to monitor and control the elevation of reference surfaces. By continuously measuring the deposited material height and adjusting subsequent deposition parameters, the system maintains precise control over surface elevation, ensuring that reference surfaces achieve the required dimensional accuracy despite the additive approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and ensures precise fit and adhesion, enhancing the efficiency and cost-effectiveness of heat sink production while maintaining functional accuracy.
Implementation Method 1
the additive manufacturing process is a cold spray process
Implementation Method 2
The contact surfaces on the heat sink below the DCB substrate must be coated with an adhesion-promoting layer to enable soldering of the substrate to the heat sink
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A heat sink for a semiconductor device is disclosed, wherein the heat sink is made of a first metallic material and the heat sink has an undersize in at least one reference surface, wherein the at least one reference surface of the heat sink is raised by means of an additive manufacturing process.