Additive Manufacturing Layer Adhesion via Concurrent Curing
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Solution Overview
Problem
Current additive manufacturing techniques using thermoplastic and thermoset resin feedstocks often experience poor adhesion between layers, leading to parts that are prone to separation and peeling.
Innovation Solution
A system comprising a delivery guide and a source of curing energy that directs curing energy to a discrete region of the curable material as a subsequent layer is dispensed, allowing for concurrent curing of adjacent layers, thereby enhancing adhesion and reducing the likelihood of separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If current additive manufacturing techniques use thermoplastic resin feedstocks and melt the resin as it is being dispensed, then the resin can be layered against previously dispensed and hardened layers, but poor adhesion between adjacent layers results, creating parts prone to separation and peeling
Solution Approach 1:
The patent applies preliminary action by directing curing energy to the previously dispensed layer before the subsequent layer is fully dispensed. This pre-cures the interface region, creating a bonding surface that enhances adhesion between layers before the subsequent layer completes its deposition, thereby preventing separation and peeling issues.
Solution Approach 2:
The patent implements dynamics by making the curing energy source movable and capable of tracking the dispensing head in real-time. This dynamic positioning allows the curing energy to continuously target the interface between layers as the dispensing progresses, ensuring consistent adhesion throughout the layering process while maintaining the ability to maneuver the system.
2Reliability
If current additive manufacturing techniques use thermoset resin feedstocks and fully cure the resin as it is being dispensed, then the fully cured material can be placed against previously dispensed and fully cured layers, but poor adhesion between adjacent layers results, creating parts prone to separation and peeling
Solution Approach 1:
The patent applies local quality by selectively curing only the interface region between layers rather than fully curing the entire subsequent layer. This localized curing approach maintains the reliability and material properties of the bulk material while creating a cured bonding surface at the interface, enabling strong adhesion without compromising the overall material integrity.
Solution Approach 2:
The patent uses preliminary action by pre-curing the previously dispensed layer at the interface region before the subsequent layer is fully deposited. This creates a ready-to-bond surface that enhances adhesion, while the bulk of the subsequent layer remains uncured or partially cured, maintaining material reliability and allowing for proper layer integration.
3Strength
If curing energy is directed to a discrete region of the curable material forward of or at the location where a subsequent layer is dispensed, then adjacent layers are cured together, improving structural integrity, but the system complexity increases
Solution Approach 1:
The patent applies self-service by making the curing energy source movable and capable of autonomously tracking the dispensing head. The system uses feedback from the dispensing process to automatically position the curing energy at the correct location, eliminating the need for complex external positioning mechanisms and reducing overall system complexity while maintaining the ability to cure adjacent layers together for improved structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively cures adjacent layers together, improving the structural integrity of the manufactured parts by ensuring strong bonding between layers, thus minimizing separation and peeling issues.
Implementation Method 1
The source of curing energy is configured to direct the curing energy to a discrete region of the curable material forward of or at a location where a subsequent layer of the curable material is dispensed from the delivery guide against a preceding layer of the curable material to cure together the subsequent layer and the preceding layer
Data Source
Figure 1~3
AI summary
Systems (10) for additive manufacturing comprise a delivery guide (12) configured to dispense a curable material (18) to additively manufacture a part (20) in sequential layers (22) of the curable material (18), and a source (14) of curing energy (16) configured to direct the curing energy (16) to a discrete region (24) of the curable material (18) forward of or at a location (25) where a subsequent layer (22a) of the curable material (18) is dispensed from the delivery guide (12) against a preceding layer (22b) of the curable material (18) to cure together the subsequent layer (22a) and the preceding layer (22b). Methods of additively manufacturing comprise dispensing a subsequent layer (22a) of a curable material (18) against a preceding layer (22b) of the curable material (18), and concurrently with the dispensing, directing curing energy (16) to a discrete region (24) of the curable material (18) to cure together the subsequent layer (22a) and the preceding layer (22b).