Additive Manifold for Semiconductor Gas Distribution
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Solution Overview
Problem
Conventional semiconductor manufacturing gas boxes face challenges with complex flow path configurations, including sharp internal edges, misalignments, gaps, and long flow path lengths, which affect fluid flow precision and increase the risk of leaks and wafer defects.
Innovation Solution
A manifold constructed using additive manufacturing with fluid flow components linked to a common mixing chamber via equal-length flow passages, arranged in a circular pattern, and featuring three-dimensional fluid flow passages without sharp internal edges, improving fluid routing and delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used to create flow paths, then manufacturing simplicity is maintained, but flow path precision and smoothness deteriorate due to sharp internal edges and misalignments
Solution Approach 1:
The patent applies parameter changes by transitioning from conventional subtractive manufacturing to additive manufacturing, fundamentally changing the manufacturing parameters and capabilities. This enables the creation of flow paths with smooth transitions and precise geometries that were previously unachievable through traditional methods, directly resolving the contradiction between manufacturing precision and ease of manufacture.
Solution Approach 2:
The patent utilizes another dimension by implementing three-dimensional flow passages that optimize fluid flow paths in multiple spatial dimensions. This allows for smoother transitions and eliminates sharp internal edges by routing flow through carefully designed 3D pathways, improving flow path precision without compromising manufacturability through additive manufacturing.
2Manufacturing precision
If complex flow path configurations are used to achieve precise gas delivery, then fluid flow precision is improved, but the risk of leaks and failure points increases
Solution Approach 1:
The patent applies merging by integrating multiple flow paths and control features into a single monolithic manifold structure fabricated through additive manufacturing. This consolidation eliminates numerous connection points, joints, and interfaces that would otherwise serve as potential leak sources, thereby maintaining fluid flow precision while significantly improving reliability by reducing the overall number of failure points.
Solution Approach 2:
The patent changes the manufacturing parameter from conventional assembly-based construction to additive manufacturing, which enables the creation of a seamless monolithic structure. This parameter change eliminates the need for multiple assembled components and their associated connection points, directly reducing leak risk while maintaining the complex flow path configurations necessary for precise gas delivery.
3Device complexity
If traditional gas box designs are used, then device simplicity is maintained, but system compactness and maintainability deteriorate
Solution Approach 1:
The patent applies segmentation by designing the manifold as a modular monolithic structure with integrated flow paths and control features. While the overall system remains simple, the internal architecture is segmented into distinct functional zones and flow paths that can be independently analyzed and maintained, improving maintainability without compromising device simplicity.
Solution Approach 2:
The patent implements universality by creating a multi-functional manifold that integrates gas distribution, flow control, and mixing functions into a single component. This consolidates multiple functions that would traditionally require separate components, improving maintainability by reducing the number of parts while maintaining system simplicity through the unified monolithic design.
Data Source
AI summary
A manifold constructed by additive manufacturing for use in semiconductor processing tools is provided. The manifold may include a mixing chamber and portions of a plurality of flow paths with each flow path including a first fluid flow component interface, a second fluid flow component interface, a first tubular passage fluidically connecting the first mixing chamber with a first fluid flow component interface outlet of that flow path, and a second tubular passage fluidically connecting a first fluid flow component interface inlet of that flow path with a second fluid flow component interface outlet of that flow path. Each fluid flow component interface is configured to interface with a corresponding fluid flow component such that the corresponding fluid flow component, when installed, is able to interact with fluid flow between the fluid flow component interface inlet and the fluid flow component interface outlet.


