Additive Manufacturing Integrated Aircraft Structures

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Solution Overview

Problem

Traditional methods for integrating electronic circuit systems into aircraft structures are cumbersome, requiring extensive wiring and separate mounting, which increases weight, complexity, and manufacturing time.

Innovation Solution

The method involves additive manufacturing to create aircraft structures with integrated electronic components, where electronic components are embedded within the structure, and conductive pathways are printed to connect them, reducing the need for external wiring and mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional wiring and mounting methods are used to integrate electronic components into aircraft structures, then electronic functionality can be achieved, but weight increases and manufacturing complexity increases

Engineering Contradiction:
Improveelectronic functionalityVSAvoidaircraft structure weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent merges the structural body and electronic circuitry into a single integrated component. The structural body is additively manufactured with conductive pathways and electronic components embedded directly within it, eliminating the need for separate wiring harnesses and mounting brackets. This integration reduces weight by removing unnecessary structural elements while maintaining electronic functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The structural body serves multiple functions simultaneously: it provides mechanical support, houses electronic components, and conducts electrical signals. The additive manufacturing process creates a universal component that combines structural and electronic functions, reducing the overall weight compared to separate specialized components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional wiring and mounting methods are used to integrate electronic components into aircraft structures, then electronic functionality can be achieved, but manufacturing complexity increases

Engineering Contradiction:
Improveelectronic functionalityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple manufacturing operations into a single additive manufacturing process. Instead of separately producing structural components, wiring harnesses, and mounting fixtures, the integrated structural body is manufactured in one operation with all conductive pathways and electronic components already positioned and connected.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The additive manufacturing process performs preliminary actions by pre-positioning and pre-connecting electronic components and conductive pathways within the structural body before final assembly. This eliminates the need for subsequent wiring and mounting operations, reducing manufacturing complexity.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If traditional wiring and mounting methods are used to integrate electronic components into aircraft structures, then electronic functionality can be achieved, but manufacturing time increases

Engineering Contradiction:
Improveelectronic functionalityVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The additive manufacturing process performs all necessary actions for electronic integration in advance during the structural body manufacturing process. Conductive pathways are formed and electronic components are positioned within the structural body before final assembly, eliminating the need for time-consuming post-processing wiring and mounting operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent merges the manufacturing of structural components and electronic systems into a single simultaneous process. The additive manufacturing of the structural body and the formation of conductive pathways occur concurrently, reducing total manufacturing time compared to sequential traditional methods.

Inventive Principle:
Principle #5Merging (Combining)

4Reliability

If external wiring and mounting components are used to connect electronic components, then electronic functionality can be achieved, but the aircraft structure becomes less compact

Engineering Contradiction:
Improveelectronic functionalityVSAvoidaircraft structure volume
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent embeds electronic components and conductive pathways within the internal structure of the structural body. The conductive pathways are formed within cavities and channels of the structural body, and electronic components are positioned within recesses, creating a nested arrangement that eliminates external wiring and reduces overall volume.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The structural body and electronic components are merged into a single compact integrated structure. The additive manufacturing process creates a unified design where electronic functionality is embedded within the structural volume, eliminating the need for separate external wiring harnesses and mounting components that would increase overall volume.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250194000A1Systems and methods for integration of electronic circuit systems into an aircraft structure
Publication Date: 2025.06.12 GOODRICH LIGHTING SYSTEMS INC
  • US20250194000A1 patent drawing
  • US20250194000A1 patent drawing
  • US20250194000A1 patent drawing

AI summary

A method for manufacturing an aircraft structure includes additively manufacturing a body portion defining a first cavity and a second cavity. The method further includes disposing electronic components in the first and second cavities. The method further includes additively manufacturing a pathway layer over the electronic components, the pathway layer defines a channel extending between and to the first electronic component and the second electronic component. The method further includes additively manufacturing a conductive pathway in the channel to extend between and to the first electronic component and the second electronic component, whereby the first electronic component is electrically coupled to the second electronic component.