Additive Manufacturing Identification Features for Semiconductor Component Authentication

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Solution Overview

Problem

Semiconductor manufacturing systems face performance degradation due to the use of third-party components that do not meet specifications, making it difficult to determine authorized components, leading to potential system malfunctions and increased support efforts.

Innovation Solution

Embedding identification features in components using additive manufacturing, specifically ultrasonic additive manufacturing, to enable a controller to verify component authorization and modify system operations or alert users if unauthorized components are detected.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If third-party components are used to replace original components, then cost is reduced and availability is improved, but component quality and system performance deteriorate

Engineering Contradiction:
Improvecomponent qualityVSAvoidcomponent availability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

An identification feature is embedded in the component during the additive manufacturing process before the component is installed in the system. This preliminary embedding allows the system to later verify the component's authorization status, ensuring that only authorized components are used while maintaining the benefits of third-party manufacturing and availability.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If component authentication is implemented to verify authorized components, then system performance and reliability are improved, but system complexity and detection difficulty increase

Engineering Contradiction:
Improvesystem performanceVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The identification feature serves multiple functions: it authenticates the component's authorization status, provides unique identification for tracking, and enables the system to determine appropriate operating parameters. This multi-functionality reduces the need for separate authentication mechanisms, thereby limiting the increase in system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If traditional manufacturing processes are used for components, then manufacturing precision is maintained, but the ability to embed identification features without extreme temperatures is lost

Engineering Contradiction:
Improvecomponent precisionVSAvoididentification feature embedding capability
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The additive manufacturing process uses different parameters than traditional manufacturing - specifically, it builds components layer by layer using deposited material that is then selectively removed to create cavities. This approach allows embedding of identification features without subjecting them to extreme temperatures, as the process uses controlled deposition and removal rather than high-heat treatment.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures only authorized components are used in semiconductor manufacturing systems, preventing performance degradation and reducing the need for product support by allowing real-time authentication and parameter adjustments based on component identity.

Implementation Method 1

This identification feature is embedded in a component by using an additive manufacturing process that allows the identification feature to be embedded in the component without subjecting the identification feature to extreme temperatures

Methodology Applied
Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Data Source

PatentUS10672634B2Embedded features for interlocks using additive manufacturing
Publication Date: 2020.06.02 VARIAN SEMICON EQUIP ASSC INC
  • US10672634B2 patent drawing
  • US10672634B2 patent drawing
  • US10672634B2 patent drawing

AI summary

The present disclosure describes a method and apparatus for determining whether components in a semiconductor manufacturing system are authorized for use in that system. By embedding an identification feature in the component, it is possible for a controller to determine whether that component is qualified for use in the system. Upon detection of an unauthorized component, the system may alert the user or, in certain embodiments, stop operating of the system. This identification feature is embedded in a component by using an additive manufacturing process that allows the identification feature to be embedded in the component without subjecting the identification feature to extreme temperatures.