Additive Manufacturing Temperature Sensor for Layer Bonding

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Solution Overview

Problem

In additive manufacturing, achieving consistent layer-to-layer bonding is challenging due to variations in the cooling rate of thermoplastic materials, which affects the quality and strength of the final structure, especially in applications requiring perfect bonding like aircraft components.

Innovation Solution

A rotary mechanism with a temperature sensor is used to accurately measure the temperature of previously deposited layers and adjust the deposition speed of the additive manufacturing apparatus, ensuring layers are printed within the ideal temperature range for strong bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the deposition speed is increased to improve productivity, then the layer cooling time is reduced and bonding quality deteriorates

Engineering Contradiction:

Improvedeposition speedVSAvoidlayer-to-layer bonding quality

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The system dynamically adjusts the deposition speed based on real-time temperature measurements of the previously deposited layer. The controller modifies the deposition rate to maintain optimal bonding conditions, transforming a static fixed-speed process into a dynamic adaptive process that responds to actual thermal conditions.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system implements feedback control by continuously measuring the temperature of the previously deposited layer and using this information to adjust the deposition speed. The temperature sensor provides real-time data to the controller, which then modifies the deposition parameters to ensure optimal bonding conditions are met.

Inventive Principle:

Principle #23Feedback

2Reliability

If the deposition speed is decreased to improve bonding quality, then productivity decreases

Engineering Contradiction:

Improvelayer-to-layer bonding qualityVSAvoiddeposition speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Rather than using a uniformly slow deposition speed, the system dynamically adjusts speed based on actual thermal conditions. This allows faster deposition when conditions permit and slower deposition when bonding quality is at risk, optimizing both productivity and reliability.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the deposition speed parameter in response to temperature measurements. By adjusting this critical process parameter based on real-time feedback, the system optimizes the balance between productivity and bonding quality without requiring uniformly reduced speeds.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If temperature monitoring is implemented to control bonding quality, then device complexity increases

Engineering Contradiction:

Improvetemperature control precisionVSAvoidsystem complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system replaces complex mechanical temperature control mechanisms with a sensor-based monitoring and software-controlled adjustment system. Instead of physically controlling temperature through complex heating/cooling mechanisms, the system uses temperature sensing and adjusts deposition parameters accordingly.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system uses the temperature information from the previously deposited layer to automatically adjust its own deposition parameters. The process essentially monitors and adjusts itself without requiring external intervention or complex external control systems.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the quality of layer-to-layer bonding by maintaining precise temperature control, resulting in stronger and more reliable structures, particularly in applications where perfect bonding is critical.

Implementation Method 1

a temperature sensor, which can be used to determine when the previously printed layer has cooled to a temperature within the ideal range

Methodology Applied

Scientific EffectThermal radiation detection: Thermal Radiation

Implementation Method 2

Thermoplastic materials used for 3D printing processes, including processes involving large-scale printers, soften when heated above their melting point and harden again when cooled

Methodology Applied

Scientific EffectMelting and solidification: Melting

Implementation Method 3

the previous layer should be have cooled and hardened by an amount sufficient to support a new layer and to tolerate the forces generated by the compression roller, tamper, etc., while retaining sufficient heat to re-melt and completely fuse with the new layer being printed

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4484122A1Systems and methods for greater inter-layer bond integrity in additive manufacturing

Publication Date: 2025.01.01 THERMWOOD CORP

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AI summary

An additive manufacturing apparatus includes an extruder (61) configured to receive a thermoplastic material and an applicator assembly (43) downstream of the extruder, the applicator assembly including a nozzle (51) for depositing the thermoplastic material as a plurality of layers. The additive manufacturing apparatus includes a temperature sensor (49) configured to detect a temperature of at least a portion of a deposited layer and a positioning assembly (56, 60, 65) configured to change an angular position of the temperature sensor, and a controller (2).