Additive Metal Body on PCB for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current component carriers face challenges in thermal heat management due to limited heat conductivity of materials like epoxy or adhesive tape used between heat sinks and printed circuit boards (PCBs), which hinders efficient heat dissipation in high-power electronic components.
Innovation Solution
A component carrier with a carrier body formed of electrically conductive and insulating layer structures, featuring a metal surface structure coupled to the layers and a metal body directly formed by additive manufacturing, eliminating the need for intermediate adhesive layers and enhancing thermal and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive materials like epoxy or adhesive tape are used to bond heat sink to PCB, then good adhesion is achieved, but heat conductivity is limited
Solution Approach 1:
The patent removes the adhesive layer entirely from the thermal management system. By using a metal body with an integrated metal surface structure that directly contacts the PCB, the design extracts and eliminates the thermally resistive adhesive material, achieving both adhesion and high heat conductivity simultaneously.
Solution Approach 2:
The invention changes the material parameter from adhesive (low thermal conductivity) to metal (high thermal conductivity). The metal body is formed directly on the PCB surface through additive manufacturing, fundamentally changing the thermal conduction parameter of the bonding interface while maintaining structural integrity.
2Ease of manufacture
If traditional manufacturing methods are used with intermediate adhesive layers, then assembly is simplified, but heat transfer efficiency is reduced
Solution Approach 1:
The patent merges the heat sink body and the bonding interface into a single integrated metal structure. The metal surface structure is formed as an integral part of the metal body through additive manufacturing, eliminating the need for separate adhesive layers and simplifying the manufacturing process while maximizing heat transfer efficiency.
Solution Approach 2:
The invention uses a composite structure where the metal body (formed by additive manufacturing) integrates directly with the PCB's metal surface structure. This composite metal-to-metal interface replaces the traditional adhesive bonding approach, providing both mechanical attachment and superior thermal conduction.
3Strength
If adhesive layers are used between heat sink and PCB, then bonding is achieved, but gaps or cavities form at the interface
Solution Approach 1:
The patent extracts and removes the adhesive layer that causes interface gaps and cavities. By creating a direct metal-to-metal contact between the heat sink body and PCB through additive manufacturing, the design eliminates the source of interface imperfections while maintaining strong bonding.
Solution Approach 2:
The invention achieves a homogeneous metal-to-metal interface without the heterogeneity introduced by adhesive layers. The direct contact between the metal body and PCB's metal surface structure creates a uniform interface with consistent thermal and mechanical properties, eliminating gaps and cavities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved thermal conductivity and efficient heat dissipation, potentially increasing heat transfer efficiency by 100 to 300 times compared to traditional methods, while reducing manufacturing costs and avoiding gaps or cavities at the interface.
Implementation Method 1
the heat conductivity of an epoxy material or an adhesive tape is limited with respect to metal materials, such as aluminum or copper, which materials generally constitute the heat sink itself
Implementation Method 2
a metal body directly on the metal surface structure formed by additive manufacturing
Data Source
AI summary
A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the carrier body and a metal body directly on the metal surface structure formed by additive manufacturing. The metal body is arranged directly on the metal surface structure without material and layers in between.