Additive Manufacturing Polishing Pads for Uniformity

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Solution Overview

Problem

Conventional polishing pad manufacturing methods result in non-uniform polishing results due to limited control over bulk pad properties such as storage modulus and loss modulus, leading to unpredictable performance across substrates, especially as IC feature sizes shrink.

Innovation Solution

The development of polishing pads with sequentially formed layers, utilizing porosity-forming agents that degrade in aqueous solutions and acrylate materials, allowing for precise control of polymer compositions and structures through additive manufacturing, enabling tunable mechanical and chemical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional polishing pad manufacturing methods are used, then production is simpler and faster, but polishing uniformity and control over pad properties deteriorate

Engineering Contradiction:
Improvepolishing uniformityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The polishing pad is divided into multiple sequentially formed layers, each with specific porosity-forming agent patterns. This segmentation allows independent control of each layer's properties while maintaining overall polishing uniformity, resolving the contradiction between manufacturing precision and process complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Porosity-forming agents are applied in specific patterns to create localized porous regions within the polishing pad structure. This local quality variation enables precise control over material properties in different areas, achieving both high polishing uniformity and manageable manufacturing complexity.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If additive manufacturing with porosity-forming agents is used, then control over pad properties improves, but manufacturing process complexity increases

Engineering Contradiction:
Improvecontrol over pad propertiesVSAvoidadditive manufacturing process
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention changes physical parameters such as porosity distribution, layer thickness, and material composition through controlled application of porosity-forming agents. These parameter changes enable precise control over pad properties while the systematic approach keeps manufacturing complexity manageable.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The polishing pad combines multiple materials including structural materials and porosity-forming agents in sequentially formed layers. This composite structure allows independent optimization of each material's properties while maintaining overall control, balancing manufacturing precision with process complexity.

Inventive Principle:
Principle #40Composite materials

3Reliability

If multiple polishing pads with different properties are used, then polishing performance is improved, but system complexity increases

Engineering Contradiction:
Improvepolishing performanceVSAvoidnumber of polishing pads
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple polishing functions are merged into a single multi-layered polishing pad structure. Each layer contributes different properties (porosity, structural integrity, polishing characteristics), achieving the performance of multiple separate pads while reducing system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sequentially formed layered polishing pad serves multiple functions simultaneously - providing structural support, controlling slurry flow through porous regions, and delivering consistent polishing performance. This multi-functionality replaces the need for multiple specialized pads, improving reliability while managing system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances polishing uniformity at both microscopic and macroscopic levels by providing improved control over pad feature geometry and material properties, leading to more consistent and efficient polishing processes.

Implementation Method 1

utilizing porosity-forming agents that degrade in aqueous solutions

Methodology Applied
Scientific EffectDgradation: Decomposition (biological)

Implementation Method 2

exposing the dispensed droplets to electromagnetic radiation to cure the polymer precursor formulations

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10953515B2Apparatus and method of forming a polishing pads by use of an additive manufacturing process
Publication Date: 2021.03.23 APPLIED MATERIALS INC
  • US10953515B2 patent drawing
  • US10953515B2 patent drawing
  • US10953515B2 patent drawing

AI summary

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.