Additively Manufactured Structure With Vernier Alignment Markers
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Solution Overview
Problem
Conventional additive manufacturing processes for electronics require time-consuming and costly quality control for job-on-job precision, which can only be performed after printing, and lack efficient methods for real-time precision checking during the process.
Innovation Solution
The implementation of a vernier-based position marker system that uses two periodic structures with different periodicities to indicate relative offsets between substructures, allowing for precise alignment and quality assurance during the printing process through optical or electrical detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional additive manufacturing processes are used, then manufacturing capability is achieved, but quality control becomes time-consuming and costly
Solution Approach 1:
The patent applies preliminary action by incorporating position markers and alignment features directly into the additive manufacturing process itself, rather than performing quality control after manufacturing. The vernier-based position markers are integrated during printing to enable real-time alignment verification, eliminating the need for separate post-printing quality control operations and reducing overall manufacturing time.
Solution Approach 2:
The patent replaces complex mechanical quality control systems (such as computer tomography examinations) with a simpler optical measurement system. The vernier-based position markers enable optical or electrical detection of alignment precision, substituting the time-consuming mechanical CT scanning process with faster optical measurement methods that can be performed during or after printing.
2Measurement precision
If quality control is performed after printing, then measurement accuracy is achieved, but manufacturing time increases
Solution Approach 1:
The patent enables continuity of useful action by allowing quality control activities to proceed concurrently with or immediately after the printing process without interruption. The position markers are designed to be readable by optical systems that can quickly verify alignment precision, eliminating the sequential bottleneck where printing must complete entirely before quality control can begin.
Solution Approach 2:
The patent uses optical copies or images of the position markers to determine alignment precision. Instead of physically measuring the entire printed structure, the system creates optical copies of the vernier-based position markers and analyzes these copies to determine job-on-job precision, significantly reducing measurement time while maintaining accuracy.
3Measurement precision
If complex quality control methods are used, then measurement accuracy improves, but device complexity increases
Solution Approach 1:
The patent extracts the essential alignment information from the complex printed structure by using dedicated vernier-based position markers. These markers contain encoded alignment data that can be read by simple optical systems, separating the alignment verification function from the main printed structure and enabling simple, low-cost quality control without complex measurement equipment.
Solution Approach 2:
The patent employs optical contrast changes or color variations in the position marker design to enable easy detection by optical systems. The vernier-based markers use patterns that create distinct optical signatures, allowing simple cameras or sensors to detect and measure alignment precision without complex electronic or mechanical measurement systems.
Data Source
AI summary
A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.