Thermal barrier for downhole flasked electronics

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Solution Overview

Problem

Downhole tools in boreholes face significant challenges due to extreme temperature and pressure conditions, which can impair the integrity, efficiency, and reliability of thermally sensitive electronic components, leading to performance degradation or failure.

Innovation Solution

The implementation of a thermal isolation system using an additive manufacturing structural framework, which includes a mesh sleeve and multi-material composition, connects thermally sensitive components to the tool, providing a longer heat path and integrating active cooling channels to minimize heat transfer and protect electronics from high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If thermally sensitive electronic components are placed in downhole tools, then the tool can perform electronic functions for monitoring and control, but the high temperature in the borehole causes the electronic components to work more slowly or fail

Engineering Contradiction:
Improveelectronic control capabilityVSAvoidelectronic component reliability
Core Design Contradiction:
Extent of automationVSReliability

Solution Approach 1:

The downhole tool is divided into thermally isolated segments: a hot section containing heat-generating components and a cool section containing thermally sensitive electronic components. The thermal isolation support structure physically separates these segments to prevent heat transfer, allowing electronic components to function reliably in high-temperature downhole environments.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A thermal isolation support structure acts as an intermediary between the hot downhole environment and the thermally sensitive electronic components. This intermediary structure provides mechanical support while minimizing thermal conduction, protecting the electronics from harmful heat transfer.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a thermal isolation support structure is added to protect electronic components, then heat transfer to components is reduced, but the device complexity increases

Engineering Contradiction:
Improvethermal protection of electronicsVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The thermal isolation support structure performs multiple functions simultaneously: it provides mechanical support for electronic components, electrically connects or isolates components as needed, and thermally isolates sensitive electronics from heat sources. This multi-functionality reduces the need for separate dedicated components for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple support members are combined into an integrated thermal isolation support structure that provides both mechanical and thermal management functions. The structure merges support, connection, and thermal isolation functions into a unified design rather than using separate components.

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If the thermal isolation support uses traditional solid structure, then mechanical strength is sufficient, but the heat path is too short and heat transfer occurs

Engineering Contradiction:
Improvestructural strengthVSAvoidheat transfer to components
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The support members are configured with curved or helical geometries instead of straight lines. This curvature increases the length of the thermal conduction path from heat sources to electronic components while maintaining structural integrity, thereby reducing heat transfer effectiveness.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The support structure transitions from a simple linear arrangement to a three-dimensional configuration with curved and helical elements. This dimensional complexity increases the thermal path length without proportionally increasing the physical space occupied, effectively reducing heat transfer.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If additive manufacturing is used to create the thermal isolation support, then manufacturing flexibility and integration are improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidstructural accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The support structure geometry is optimized for additive manufacturing processes, utilizing parameters such as lattice infill patterns, wall thickness variations, and gradual transitions that are naturally suited to layer-by-layer manufacturing. These parameter changes enable complex geometries to be manufactured with standard additive precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The thermal isolation support may incorporate composite material structures or multi-material additive manufacturing to achieve both mechanical strength and thermal isolation properties. Different materials or material combinations are used to optimize both structural performance and thermal management characteristics.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prolongs the temperature survival time of downhole tools, allowing them to operate safely in high-temperature environments for extended periods by reducing heat transfer and maintaining the reliability of thermally sensitive components.

Implementation Method 1

The additive manufacturing support structure minimizes heat transfer from the environment to the internal components

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11306578B2Thermal barrier for downhole flasked electronics
Publication Date: 2022.04.19 BAKER HUGHES CO
  • US11306578B2 patent drawing
  • US11306578B2 patent drawing
  • US11306578B2 patent drawing

AI summary

Apparatus and methods directed to an assembly associated with a downhole tool, and including: a thermal housing; at least one internal component inside the thermal housing, wherein the at least one internal component comprises at least one thermally sensitive component; and a thermal isolation support connecting the at least one internal component to the tool. The thermal isolation support may comprise an additive manufacturing structural framework connected to the tool. The structural framework may include a plurality of structural members, with a majority of the plurality of structural members substantially non-parallel with a longitudinal axis of the downhole tool.