Systems and methods for using additive manufacturing for thermal management
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Solution Overview
Problem
Conventional thermal management systems for electronic devices are limited by size and weight constraints, leading to reduced processing power and functionality due to inefficient heat dissipation, particularly in high ambient temperature environments.
Innovation Solution
A thermal management system utilizing 3D printed heatframes, heat fins, and vapor chambers with integrated wick structures and support structures to enhance heat transfer and reduce thermal resistance, allowing for improved heat dissipation in a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods such as fans and heatsinks are used, then heat dissipation is achieved, but size and weight constraints limit the cooling capacity and processing power
Solution Approach 1:
The patent combines multiple thermal management components (heat frame, vapor chamber, heat fins, support structures) into a single integrated unit. This merging eliminates the need for separate conventional cooling components like fans and standalone heatsinks, achieving superior heat dissipation while reducing overall system weight and volume.
Solution Approach 2:
The vapor chamber utilizes phase transition of working fluid between liquid and vapor states to transfer heat efficiently. The fluid evaporates at the heat input region (absorbing heat) and condenses at the heat output region (releasing heat), providing high heat dissipation capability in a compact, lightweight structure.
2Temperature
If 3D printed vapor chambers with integrated structures are used, then thermal performance is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent employs additive manufacturing (3D printing) technology to create complex vapor chamber geometries that would be difficult or impossible to manufacture using conventional methods. This manufacturing parameter change enables integrated structures with optimized thermal pathways, internal wick patterns, and support features that enhance thermal performance while actually simplifying the overall manufacturing process by reducing assembly steps.
3Reliability
If processors are de-rated to avoid overheating, then thermal issues are avoided, but processing capability is drastically reduced
Solution Approach 1:
The vapor chamber's phase change mechanism provides highly efficient heat removal, maintaining thermal stability even at high processing loads. This allows processors to operate at full capability without de-rating, as the phase transition process continuously absorbs and transports heat away from the processor, preventing overheating while maximizing productivity.
4Productivity
If device density is increased, then computing power is enhanced, but thermal management becomes more critical and difficult
Solution Approach 1:
The integrated vapor chamber design merges heat frame, vapor chamber, heat fins, and support structures into one unit that can accommodate high-density processor arrangements. This consolidation simplifies thermal management for high-density devices by providing a unified heat removal solution that handles multiple heat sources simultaneously, reducing the complexity that would otherwise arise from managing thermal zones individually.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves superior thermal performance by integrating 3D printed vapor chambers with wick structures and support structures, enhancing heat transfer efficiency and reducing the size and weight of thermal management systems, thereby increasing processing power and functionality.
Implementation Method 1
A plurality of wick structures are interiorly disposed on at least some of the component side and the opposing side
Implementation Method 2
the thermal management system includes a vapor chamber having a vapor chamber case with a component side and an opposing vapor side, internal wick structures disposed on at least the component side, internal working fluid
Implementation Method 3
heat fins and/or heat exchanger is disposed on an exterior of the 3D vapor chamber
Implementation Method 4
heat fins and/or heat exchanger is disposed on an exterior of the 3D vapor chamber
Data Source
AI summary
According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.