Addressable Plasma Emitters for Uniform, Flexible Processing
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Solution Overview
Problem
Achieving high uniformity and flexibility in plasma processing is challenging due to complex interactions between plasma uniformity, chamber design, and process control parameters, leading to large and expensive equipment setups that are inflexible and costly for process changes.
Innovation Solution
Implementing a digital process control system that uses time-dependent activation of plasma elements to expose substrates to plasma fluxes, allowing independent control of plasma cells and flexible process recipes through machine learning algorithms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional analog plasma processing systems are used to achieve high process uniformity, then process uniformity can be maintained within a few percent, but the equipment becomes large, expensive, and inflexible for process changes
Solution Approach 1:
The plasma processing chamber is divided into multiple independently controllable plasma zones or regions, each with its own plasma generation and control capabilities. This segmentation allows localized process optimization without requiring a large overall chamber, reducing equipment size while maintaining uniformity through distributed control
Solution Approach 2:
The system implements dynamic control of plasma parameters through digital addressing of plasma elements, allowing real-time adjustment of plasma flux, power, and timing for each zone. This dynamic capability enables flexible process changes without hardware modifications, reducing equipment complexity while maintaining precision
2Reliability
If traditional analog plasma systems are designed for specific process specifications, then process control can be optimized for narrow ranges, but the systems lack flexibility for modern innovation and process changes
Solution Approach 1:
The system enables independent digital control of multiple plasma parameters including power, pressure, gas flow, and timing for each plasma element. This multi-parameter control allows the system to be optimized for specific processes while maintaining flexibility to adapt to new processes by simply changing control parameters rather than hardware
Solution Approach 2:
The plasma processing system is designed with universal plasma elements that can perform multiple process functions through digital addressing and control. A single chamber can execute various plasma processes (etching, deposition, cleaning, annealing) by reconfiguring which plasma elements are active and their control parameters, providing both optimization for specific processes and flexibility for innovation
3Manufacturing precision
If large plasma volume is used to achieve process uniformity, then basic uniformity within a few percent can be achieved, but it becomes a problem for processes requiring quick change of chemistry
Solution Approach 1:
The plasma volume is segmented into multiple independently controllable zones with separate plasma generation capabilities. This allows different chemical environments to be maintained in different zones simultaneously, enabling quick chemistry changes by simply activating or deactivating specific plasma zones without needing to change the entire chamber atmosphere
Solution Approach 2:
The system uses periodic pulsing of plasma elements with independently controllable timing for each zone. This allows rapid switching between different plasma chemistries by controlling the on/off timing of different plasma elements, achieving quick chemistry changes while maintaining uniform process conditions during active plasma generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances process precision, flexibility, and reduces equipment costs by enabling precise adjustment of process parameters without major hardware changes, achieving improved uniformity and resolution in plasma processing.
Implementation Method 1
a first set of plasma exposure values each associated with a respective plasma element of a plurality of plasma elements designed to generate plasma related fluxes
Data Source
AI summary
Devices, assemblies, and system including a plasma delivery device comprising a memory element that stores a first state or a second state. The memory element is configured to receive a first signal that causes the memory element to change between the first state and the second state. The plasma delivery device further includes a switch coupled to the memory element. The switch is configured to change between an open configuration and a closed configuration. The plasma delivery device further comprises a plasma emitter coupled to the switch. The plasma emitter is configured to be selectively activated and deactivated. The plasma emitter supplies plasma related fluxes to an environment proximate the plasma delivery device responsive to being activated. The plasma emitter is configured to receive a second signal that activates the plasma emitter based on the open configuration or the closed configuration of the switch.