Adherable Earphone Structure Using Facial Bone Conduction
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Solution Overview
Problem
Conventional wireless earphones lack improvements in design and functionality, particularly in how they are worn and how audio signals are transmitted to the user.
Innovation Solution
A portable electronic assembly with an adherable earphone structure that includes a carrier substrate, audio signal receiver, audio signal processor, audio signal player, protective layer, and adhesive layer, allowing the earphone to be positioned out of the ear without direct contact and transmitting audio signals through bone conduction using the facial bone.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional wireless earphones are designed to fit inside the ear canal, then good sound isolation and audio quality can be achieved, but user comfort and hygiene are compromised due to direct contact with the ear
Solution Approach 1:
The patent introduces a facial bone as an intermediary medium to transmit audio signals from the earphone to the user's inner ear, eliminating the need for direct ear canal contact. The earphone adheres to the outer ear or facial bone area, using bone conduction to deliver sound while maintaining a non-contact relationship with the ear canal, thus resolving the contradiction between sound isolation and hygiene.
2Ease of operation
If earphones are designed to adhere to the ear or head, then stable positioning and wireless freedom are achieved, but the structure becomes more complex requiring adhesive layers and carrier substrates
Solution Approach 1:
The patent divides the earphone system into distinct functional modules: a carrier substrate for structural support, an adhesive layer for attachment, and the audio signal components. This segmentation allows each component to perform its specific function efficiently while simplifying the overall assembly process and making the complex adhesive structure more manageable and manufacturable.
3Volume of moving object
If the earphone structure is made compact for portability, then wearability is improved, but the audio components may be insufficient for high-quality sound transmission
Solution Approach 1:
The patent changes the transmission parameter from air conduction to bone conduction, which allows for effective audio transmission with compact component sizing. Bone conduction efficiently transmits low-frequency sounds through the facial bone directly to the inner ear, enabling high-quality audio transmission in a compact form factor that maintains portability while ensuring reliable sound delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient transmission of audio signals without direct ear contact, enhancing user experience and potentially improving sound quality by using bone conduction, while maintaining a compact and wearable design.
Implementation Method 1
transmitting audio signals through bone conduction using the facial bone
Data Source
AI summary
A portable electronic assembly and an adherable earphone structure thereof are provided. The adherable earphone structure includes a carrier substrate, an audio signal receiver, an audio signal processor, an audio signal player, a protective layer, and an adhesive layer. The audio signal receiver is configured for receiving an audio signal provided by a portable electronic device. The audio signal processor and the audio signal player are disposed on the carrier substrate and electrically connected to the audio signal processor. The protective layer is configured for covering the audio signal receiver, the audio signal processor and the audio signal player. The adhesive layer is disposed on the carrier substrate or the protective layer. When the adhesive layer is disposed on a face and near an ear of a user, the adherable earphone structure is disposed outside the ear of the user without touching the ear by the adhesive layer.