Adhered Multilayer Die Unit for Probe Card Structural Integrity

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Solution Overview

Problem

Conventional probe cards face difficulties in drilling large-area dies due to increased thickness, leading to size restrictions and adhesive-related issues such as spillage and levelness deviations, which affect probe performance and structural strength.

Innovation Solution

An adhered multilayer die unit is designed with a probe zone and a non-probe zone, where dies are drilled individually and then adhered using an adhesive layer in the non-probe zone, avoiding size restrictions and adhesive-related problems while maintaining structural strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the die thickness is increased to provide sufficient structural strength for large-area probe cards, then the structural strength is improved, but the drilling process becomes difficult due to large aspect ratio through holes

Engineering Contradiction:

Improvestructural strengthVSAvoiddrilling process

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The die is divided into multiple thinner layers (first die layer, second die layer, third die layer) stacked together. Each layer can be drilled individually with smaller aspect ratio holes, avoiding the difficulty of drilling through a single thick die while maintaining the overall structural strength through the stacked configuration.

Inventive Principle:

Principle #1Segmentation

2Strength

If fastening members such as bolts are used to combine dies, then the structural strength is improved, but size restriction is imposed depending on the fastening members and the size of the region for disposing the fastening members

Engineering Contradiction:

Improvestructural strengthVSAvoidsize restriction

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The mechanical fastening system (bolts) is replaced with an adhesive bonding system. The adhesive layer can be applied in the non-probe zone to bond the dies together without requiring holes or mechanical fasteners, thereby eliminating size restrictions and allowing flexible design of large-area probe cards.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If adhesive is used to combine dies, then size restriction is avoided, but adhesive spillage may occur and affect the surrounding probes, or levelness deviation may occur caused by too large quantity of adhesive

Engineering Contradiction:

Improvesize restrictionVSAvoidadhesive spillage and levelness deviation

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The adhesive is applied locally in the non-probe zone rather than uniformly across the entire die surface. This localized application prevents adhesive from reaching the probe areas, avoiding contamination of probes while still providing sufficient bonding strength between die layers.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The non-probe zone is specifically designated and prepared before adhesive application. By pre-defining the adhesive application area in the non-probe zone, the process ensures that adhesive will not spill into probe areas, preventing contamination and levelness deviation issues.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances production efficiency and product quality by ensuring great structural strength and preventing adhesive spillage, allowing for a large number of probes to be inserted without affecting the probes, thus improving testing efficiency and accuracy.

Implementation Method 1

The at least one adhesive layer adheres the connecting surfaces of the dies to each other

Methodology Applied

Scientific EffectAdhesive: Adhesive

Data Source

PatentUS20250020692A1Adhered multilayer die unit and probe head, probe seat, probe card and test system including the same

Publication Date: 2025.01.16 MPI CORP

AI summary

An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.