Adhesion Adjusting Layer for Wiring Board Support Body Peeling
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Solution Overview
Problem
In the manufacturing method of wiring boards, the rigid adhesion between the support substrate and metal foil outside the wiring forming area makes it difficult to peel off the metal foil, resulting in reduced yields and potential incompatibility with existing manufacturing facilities due to the need for cutting out peripheral portions.
Innovation Solution
A support body structure is introduced with an adhesion adjusting layer embedded in the substrate and a peeling layer on the metal foil, allowing for easy separation by adjusting the contact area between the peeling layer and the substrate, enabling mechanical peeling without cutting the support body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the support substrate and metal foil are adhered rigidly outside the wiring forming area, then the structural stability is improved, but the ease of peeling off the metal foil deteriorates
Solution Approach 1:
The support substrate is divided into two functional regions: an outer peripheral portion that provides structural stability and an inner wiring forming area that allows easy peeling. The adhesion adjusting layer is selectively placed only in the inner region, creating a segmented adhesion structure that resolves the contradiction between overall stability and localized peeling ease.
Solution Approach 2:
Different adhesion properties are applied to different regions of the support substrate. The outer peripheral portion has strong adhesion for stability, while the inner wiring forming area has reduced adhesion through the adhesion adjusting layer, allowing easy peeling. This local differentiation of adhesion quality resolves the contradiction between stability and ease of operation.
2Ease of operation
If the outer peripheral portion of the support body is cut out to enable peeling, then the ease of removing support body is improved, but the productivity deteriorates due to loss of usable wiring boards
Solution Approach 1:
The adhesion adjusting layer is pre-formed in the inner wiring forming area before the metal foil is applied. This preliminary modification of adhesion properties in the inner region enables easy peeling without requiring subsequent cutting of the outer peripheral portion, thus preserving all wiring boards for production use.
3Ease of operation
If the outer peripheral portion is cut out to enable peeling, then the ease of removing support body is improved, but the device complexity increases due to incompatibility with existing manufacturing facilities
Solution Approach 1:
The adhesion adjusting layer is extracted or removed specifically from the inner wiring forming area, creating a localized low-adhesion zone. This extraction of adhesion in the inner region enables easy peeling without requiring any cutting operations, maintaining compatibility with existing manufacturing facilities that cannot handle complex post-processing.
4Ease of operation
If the adhesion adjusting layer is embedded in the support substrate, then the ease of peeling the peeling layer is improved, but the device complexity increases
Solution Approach 1:
The adhesion adjusting layer is implemented as a thin, simple, and inexpensive layer that is embedded in the support substrate. This simple structure provides the necessary adhesion control function without adding significant complexity to the overall device, enabling easy peeling while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient removal of the support body and metal foil, increasing the number of usable wiring boards and maintaining the size of the multilayer wiring structure, thus optimizing the manufacturing process.
Implementation Method 1
an adhesion adjusting layer embedded in the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate
Data Source
AI summary
A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.