Adhesion Layer Composition for Imprint Lithography Defect Reduction
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Solution Overview
Problem
The imprint technique for manufacturing microstructures, such as semiconductor devices, faces issues with low adhesion between the curable composition and the base material, leading to defects like unfilling and film thickness unevenness due to defects in the adhesion layer, which can cause pattern peeling and mold deformation.
Innovation Solution
A layer forming composition with a surfactant having an HLB value of 1 to 5 is used to form an adhesion layer that enhances the contact between the base material and the curable composition, comprising a compound with functional groups for bonding, a cross-linker, and a solvent, improving the adhesion strength and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesion layer is formed to improve adhesion between curable composition and base material, then adhesion strength is improved, but defects in the adhesion layer cause unfilling defects and film thickness unevenness
Solution Approach 1:
The invention changes the chemical composition parameters of the adhesion layer by incorporating specific compounds (silane-modified polyether block amide resin, titanium alkoxide, aluminum alkoxide) in controlled ratios. This compositional parameter adjustment enables the adhesion layer to achieve both high adhesion strength and defect-free uniformity, resolving the contradiction between strength improvement and precision maintenance
Solution Approach 2:
The invention creates a composite adhesion layer system combining multiple materials (polyether block amide resin, silane modifiers, titanium alkoxide, aluminum alkoxide) that work synergistically. The composite structure provides both the adhesion enhancement needed for strong bonding and the defect reduction required for uniform film formation, simultaneously addressing both requirements
2Reliability
If adhesion layer is formed to prevent pattern peeling during mold separation, then pattern integrity is improved, but adhesion layer defects cause mold deformation and breaking
Solution Approach 1:
By adjusting the chemical composition parameters of the adhesion layer (specific ratios of silane-modified polyether block amide resin, titanium alkoxide, and aluminum alkoxide), the invention creates an adhesion layer that provides sufficient bonding strength for pattern integrity while maintaining defect-free uniformity that prevents mold deformation and breaking during separation
Solution Approach 2:
The adhesion layer acts as an intermediary between the base material and curable composition, and the invention optimizes this intermediary's properties to simultaneously provide strong adhesion for pattern integrity and defect-free characteristics that protect the mold from deformation and damage during the separation process
3Ease of manufacture
If conventional adhesion layer materials are used to simplify the process, then ease of manufacture is improved, but unfilling defects and film thickness unevenness occur
Solution Approach 1:
The invention specifies precise compositional parameters for the adhesion layer (containing silane-modified polyether block amide resin, titanium alkoxide, and aluminum alkoxide in specific ratios), which maintains a relatively simple two-step process (adhesion layer formation followed by curable composition application) while achieving defect-free high-quality adhesion layers that eliminate unfilling and thickness unevenness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively forms a low-defect adhesion layer that enhances the adhesion strength between the base material and the cured film, reducing the occurrence of unfilling defects and film thickness unevenness, and improves the mold separation process.
Implementation Method 1
a layer forming composition used to form an adhesion layer that brings a base material and a curable composition into tight contact with each other, comprising a surfactant (D) whose HLB value is 1 to 5
Implementation Method 2
comprising a compound (A) having at least one functional group capable of bonding to a base material
Implementation Method 3
a cross-linker (B), wherein the adhesion layer forming composition comprises the surfactant (D)
Data Source
AI summary
The present invention provides a layer forming composition used to form an adhesion layer that brings a base material and a curable composition into tight contact with each other, comprising a surfactant (D) whose HLB value is 1 to 5.