Thin Film Adhesion Layer Formation for Ni Silicidation
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Solution Overview
Problem
In the manufacturing of high-density semiconductor devices, the formation of an adhesion layer with an appropriate thickness is crucial for successful electroless Ni plating, as excessive thickness hinders silicidation of the Ni plating layer.
Innovation Solution
An adhesion layer forming method and system that involves rotating a substrate and supplying a coupling agent diluted with a hydrophilic organic solvent, such as isopropyl alcohol, to ensure a uniform thin film adhesion layer is formed, facilitating the subsequent silicidation of the Ni plating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick adhesion layer is formed on the substrate, then adhesion strength is improved, but silicidation of the Ni plating layer cannot occur
Solution Approach 1:
The invention changes the thickness parameter of the adhesion layer from conventional thick (excessively large) to thin (appropriate thickness). This parameter change enables the Ni plating layer to contact the silicon substrate directly and undergo silicidation, while still maintaining sufficient adhesion strength through optimized coupling agent formulation and application method
Solution Approach 2:
The invention uses a coupling agent as an intermediary substance to form the adhesion layer. By controlling the coupling agent concentration, dilution ratio with hydrophilic organic solvent, and application conditions, the adhesion layer achieves both adequate adhesion strength and sufficient thinness to allow Ni silicidation
2Reliability
If the adhesion layer thickness is reduced to enable silicidation, then silicidation can occur, but adhesion strength may be compromised
Solution Approach 1:
The invention optimizes multiple parameters simultaneously: coupling agent concentration, dilution ratio with hydrophilic organic solvent, substrate rotation speed, and solution supply rate. These coordinated parameter changes enable the formation of a thin adhesion layer with appropriate thickness that maintains both silicidation capability and adequate adhesion strength
Solution Approach 2:
The invention employs dynamic control during the adhesion layer formation process, including substrate rotation during coupling agent application and controlled solution supply rates. This dynamic approach ensures uniform thin film formation with appropriate thickness and consistent adhesion properties across the substrate surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the formation of a thin film adhesion layer that securely adheres to the substrate, enabling effective silicidation of the Ni or Ni-based alloy plating layer and preventing voids or reduced wiring volume issues.
Implementation Method 1
supplying a coupling agent onto the substrate while rotating the substrate
Implementation Method 2
supplying a coupling agent onto the substrate while rotating the substrate... to form an adhesion layer
Implementation Method 3
the coupling agent diluted with an organic solvent having hydrophilicity is supplied while maintaining the substrate in a wet state
Data Source
AI summary
An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.