Adhesion Layer for Through-Hole Via Electrode Substrate

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Solution Overview

Problem

In substrates with through electrodes, there is a need to enhance the adhesion between the hole wall and the conductor to prevent peeling and leakage current, while also ensuring electrical insulation.

Innovation Solution

A substrate intermediary body with an adhesion layer formed from a reaction product of a polymer with cationic functional groups and a polyvalent carboxylic acid compound, applied in a method involving film formation, heating, and electrode formation, to improve adhesion and reduce leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional polymer coating is applied to the hole wall, then the adhesion between substrate and conductor is improved, but leakage current increases due to poor electrical insulation

Engineering Contradiction:
Improveadhesion between hole wall and conductorVSAvoidleakage current
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent uses a composite adhesion layer containing both polymer material (for adhesion) and inorganic filler particles (for electrical insulation). This composite structure allows the layer to simultaneously provide strong bonding between the hole wall and conductor while preventing leakage current through the insulating properties of the inorganic filler.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the composition parameters of the adhesion layer by incorporating inorganic filler particles with specific insulating properties into the polymer matrix. This parameter change transforms the layer from a purely conductive polymer coating to a composite material with balanced adhesion and insulation characteristics.

Inventive Principle:
Principle #35Parameter changes

2Object-generated harmful factors

If no adhesion layer is used, then leakage current is suppressed, but the conductor peels from the substrate

Engineering Contradiction:
Improveelectrical insulationVSAvoidadhesion between hole wall and conductor
Core Design Contradiction:
Object-generated harmful factorsVSStrength

Solution Approach 1:

The composite adhesion layer combines polymer material that provides bonding strength with inorganic filler particles that provide electrical insulation. This allows the layer to simultaneously prevent conductor peeling through adhesion while suppressing leakage current through insulation.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The adhesion layer exhibits different functional properties at different scales: at the interface with the conductor and substrate, the polymer provides strong adhesion, while within the bulk of the layer, the inorganic filler particles create insulating barriers that prevent leakage current paths.

Inventive Principle:
Principle #3Local quality

3Strength

If a thick adhesion layer is applied to ensure good adhesion, then peeling is suppressed, but leakage current increases

Engineering Contradiction:
Improveadhesion between hole wall and conductorVSAvoidleakage current
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

By using a composite material with inorganic insulating filler dispersed in the polymer matrix, the layer can maintain adequate adhesion strength even at thin thicknesses while providing effective electrical insulation that prevents leakage current, thus avoiding the trade-off between thickness, adhesion, and insulation.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively enhances adhesion between the substrate and conductor, suppressing peeling and leakage current, thereby improving the reliability of the through-hole via electrode substrate.

Implementation Method 1

a film containing a polymer (A) having a cationic functional group... is formed on a wall surface of a hole

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

an adhesion layer formed from a reaction product of a polymer with cationic functional groups and a polyvalent carboxylic acid compound

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 3

a method involving film formation, heating, and electrode formation

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentUS10950532B2Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method
Publication Date: 2021.03.16 MITSUI CHEMICALS INC
  • US10950532B2 patent drawing
  • US10950532B2 patent drawing
  • US10950532B2 patent drawing

AI summary

A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.