Adhesion Promoter Layer for Printed Circuit Board Delamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Printed circuit boards and semiconductor packages face challenges with delamination between copper patterns and epoxy-containing members, leading to reduced reliability and slower signal transmission speeds due to the need for large surface roughness on copper patterns, which can also cause pattern collapse.
Innovation Solution
Incorporating an adhesion promoter layer, such as an aluminum oxide layer, between the copper patterns and the epoxy-containing members to increase adhesive force and prevent delamination, allowing for a smoother copper pattern surface and improved reliability without the need for large surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If large surface roughness is applied to copper patterns to increase adhesion, then adhesion strength is improved, but signal transmission speed decreases and pattern collapse risk increases
Solution Approach 1:
An adhesion promoter layer is introduced as an intermediary between the copper pattern and the epoxy-containing member. This intermediate layer provides sufficient adhesion strength without requiring large surface roughness on the copper pattern, thereby maintaining smooth copper surfaces for faster signal transmission while preventing delamination.
Solution Approach 2:
The invention changes the adhesion mechanism from relying on physical mechanical interlocking through surface roughness to chemical bonding through the adhesion promoter layer. This parameter change allows the copper pattern surface to remain smooth (improving signal transmission) while achieving strong adhesion through the chemical properties of the adhesion promoter layer.
2Strength
If large surface roughness is applied to copper patterns to increase adhesion, then adhesion strength is improved, but manufacturing precision deteriorates due to pattern collapse
Solution Approach 1:
The adhesion promoter layer serves as a mediator that transfers adhesion forces without requiring deformation or roughening of the copper pattern. This preserves the original pattern geometry and dimensions, maintaining manufacturing precision while achieving the necessary adhesion strength.
Solution Approach 2:
By changing from mechanical adhesion (requiring surface roughness) to chemical adhesion (through adhesion promoter layer), the copper pattern surface remains smooth and dimensionally stable, preventing pattern collapse and maintaining manufacturing precision.
3Reliability
If adhesion promoter layer is added between copper patterns and epoxy-containing members, then reliability is improved by preventing delamination, but device complexity increases
Solution Approach 1:
A thin adhesion promoter layer is added as an intermediary between the copper pattern and epoxy-containing member. This single additional layer provides delamination resistance and improves reliability without significantly increasing overall device complexity, as the layer is thin and integrates seamlessly into the existing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesion promoter layer enhances the reliability of both printed circuit boards and semiconductor packages by preventing delamination and allowing for faster signal transmission speeds while reducing the risk of copper pattern collapse.
Implementation Method 1
an adhesion promoter layer interposed between the copper pattern and the epoxy-containing member
Data Source
AI summary
A printed circuit board comprises an epoxy-containing member, a first copper pattern disposed adjacent to the epoxy-containing member, and a first adhesion promoter layer interposed between the epoxy-containing member and the first copper pattern.