Adhesion Promoter for Polymer Waveguide Delamination

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Solution Overview

Problem

The semiconductor industry faces challenges with interface peeling and delamination issues between different material layers in polymer waveguide devices due to thermally induced stresses and surface property differences, leading to poor bonding and reliability concerns.

Innovation Solution

An adhesion promoter layer made of low-k dielectric materials like aminopropyltriethoxysilane (APTES) is conformally deposited over the reflecting mirror and polymer layers, enhancing bonding strength through chemical reactions and uniform coating, thereby reducing defects such as peeling and delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If different materials are used for the reflecting mirror and bottom cladding layer to achieve functional requirements, then the device functionality is improved, but bonding strength between layers deteriorates

Engineering Contradiction:

Improvedevice functionalityVSAvoidbonding strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

An adhesion promoter layer is introduced as an intermediary between the reflecting mirror and the bottom cladding layer. This intermediate layer is specifically designed to bond to both the metallic reflecting mirror surface and the polymer cladding material, resolving the incompatibility between dissimilar materials while maintaining device functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The interface structure is transformed into a composite material system consisting of multiple layers with different properties: the metallic reflecting mirror, the adhesion promoter layer with intermediate properties, and the polymer bottom cladding layer. This composite structure leverages the strengths of each material while mitigating their incompatibilities.

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If spin-on coating technique is used to deposit polymer layers to achieve uniform coating, then coating uniformity is improved, but adhesion between layers deteriorates

Engineering Contradiction:

Improvecoating uniformityVSAvoidadhesion between layers

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The adhesion promoter layer is deposited on the reflecting mirror surface before the spin-on coating of the polymer bottom cladding layer. This preliminary action prepares the surface with enhanced adhesion properties, ensuring that when the polymer layer is subsequently applied via spin-coating, strong bonding occurs without compromising coating uniformity.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If thermally induced stresses are present during fabrication to achieve material deposition, then manufacturing process is simplified, but interface peeling and delamination occur

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidinterface stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The adhesion promoter layer serves as a cushioning layer deposited beforehand to absorb and accommodate thermally induced stresses that occur during subsequent fabrication processes. This intermediate layer prevents stress transmission to the interface between the reflecting mirror and bottom cladding layer, thereby preventing peeling and delamination while maintaining manufacturing simplicity.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesion promoter layer improves the bonding strength between the substrate and polymer layers, reducing defects and ensuring reliable waveguide device performance by forming strong interfaces and uniform coatings, which enhances the reliability of the waveguide devices.

Implementation Method 1

enhancing bonding strength through chemical reactions

Methodology Applied

Scientific EffectChemical reactions: Chemical Bonding

Implementation Method 2

conformally deposited over the reflecting mirror and polymer layers, enhancing bonding strength through chemical reactions and uniform coating

Methodology Applied

Scientific EffectConformal deposition: Deposition (physical)

Data Source

PatentUS10983278B2Adhesion promoter apparatus and method

Publication Date: 2021.04.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An apparatus comprises a substrate having a plateau region and a trench region, a metal layer over the plateau region, a semiconductor component over the trench region, wherein a gap is between the plateau region and the semiconductor component, an adhesion promoter layer over the plateau region, the semiconductor component and the gap, a dielectric layer over the adhesion promoter layer and a bonding interface formed between the adhesion promoter layer and the dielectric layer, wherein the bonding interface comprises a chemical structure comprising a first dielectric material of the adhesion promoter layer and a second dielectric material of the dielectric layer.