Adhesion Spacer for IC Package-in-Package Delamination
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Solution Overview
Problem
Current multi-chip packages face issues with delamination due to low adhesion between spacer structures and encapsulation materials, leading to reliability concerns and performance limitations in integrated circuit package-in-package systems.
Innovation Solution
A mountable integrated circuit package-in-package system is developed, featuring an adhesion spacer between the integrated circuit die and package substrate, along with an inner adhesion structure that enhances adhesion between the spacer and the encapsulation, mitigating delamination and improving thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional spacer structures and encapsulation material are used in package-in-package structures, then manufacturing is simpler and cost is lower, but adhesion is poor and delamination occurs leading to poor reliability
Solution Approach 1:
An adhesion promoter layer is introduced as an intermediary between the spacer structure and the encapsulation material. This promoter layer specifically enhances the bonding interface, preventing delamination while maintaining the overall simplicity of the manufacturing process. The promoter acts as a mediator that resolves the adhesion problem without requiring complete redesign of the spacer or encapsulation structures.
Solution Approach 2:
The spacer structure is designed as a composite material system combining multiple layers with different properties. The adhesion promoter layer is integrated into the spacer structure, creating a composite that provides both the mechanical spacing function and the chemical adhesion function. This composite approach improves reliability without significantly increasing device complexity.
2Temperature
If conventional spacer structures are used in stacked configurations, then manufacturing is easier, but thermal performance is insufficient
Solution Approach 1:
The thermal performance is improved by changing the material parameters of the spacer structure. High thermal conductivity materials are selected for the adhesion promoter layer and spacer components, transforming the thermal properties without fundamentally altering the manufacturing process. This allows the stacked configuration to maintain its manufacturing ease while achieving superior thermal management.
Solution Approach 2:
The adhesion promoter layer serves as a thermal conduit between the integrated circuit die and the substrate. By selecting materials with appropriate thermal conductivity, this intermediary layer facilitates heat transfer from the die through the spacer structure to the substrate, improving overall thermal performance while maintaining the simple stacked manufacturing approach.
3Productivity
If integrated circuit density is increased through multi-chip packages, then more circuits fit on a substrate, but delamination at the spacer interface reduces yield
Solution Approach 1:
The adhesion promoter layer acts as a protective intermediary at the critical spacer-encapsulation interface where delamination typically occurs. This promoter layer is specifically designed to withstand the stresses of high-density packaging while maintaining strong adhesion, thereby preventing delamination and improving manufacturing yield in high-density multi-chip packages.
Solution Approach 2:
The adhesion promoter layer provides beforehand cushioning against delamination forces that occur during manufacturing and operation. By pre-establishing a strong bonding interface with the promoter layer, the structure is protected against the stresses of high-density packaging, preventing yield loss from delamination in advance rather than attempting to fix it after occurrence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces delamination and enhances thermal performance, improving reliability and manufacturing efficiency while maintaining cost-effectiveness.
Implementation Method 1
adhesion spacer between the integrated circuit die and package substrate
Implementation Method 2
inner adhesion structure that enhances adhesion between the spacer and the encapsulation
Data Source
AI summary
A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer, and forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer.