Adhesive Application Nozzle for Uniform Flow and Reduced Scattering

The patent applies local quality by making the flow path lengths different for different ejection ports. Specifically, the flow path length is extended for ejection ports located at the ends of the plate array, while the central ejection ports have shorter flow paths. This creates location-specific flow path characteristics to compensate for the natural non-uniform flow distribution that occurs in multi-port systems, thereby achieving uniform adhesive application across all ports.

The patent applies asymmetry by inclining the adhesive ejection ports relative to the rubber thread moving direction. The ejection ports are oriented at an angle (not perpendicular) to the direction of motion, which creates a controlled asymmetric application pattern. This angular orientation allows the adhesive to be applied in a direction that reduces scattering while maintaining ease of operation, as the inclined configuration naturally guides the adhesive along the rubber thread rather than allowing it to scatter in all directions.

The patent applies preliminary action by pre-configuring the flow path lengths and ejection port angles before the adhesive application process begins. The flow path lengths are designed in advance to compensate for high-speed application effects, and the ejection ports are pre-inclined at optimal angles. This preliminary design allows the system to maintain both high productivity and high bonding quality without requiring real-time adjustments during operation.