Sensorized Adhesive Connection State Detection for Bond Alignment
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Solution Overview
Problem
Existing technologies do not effectively monitor the state of connection systems, particularly releasable connections, such as those using hook-and-loop fasteners, to determine bond formation, alignment, and bond strength.
Innovation Solution
A method and system that utilize a sensor arrangement to detect parameters related to the state of adhesive bonds, including presence, alignment, and strength, using sensors like optical, magnetic, and pressure sensors, integrated into or arranged on adhesives, with communication components for data processing and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are integrated into adhesive elements to monitor bond state, then measurement precision of adhesive bond parameters is improved, but device complexity increases
Solution Approach 1:
The sensor arrangement is integrated into the adhesive element structure itself, with sensors nested within or on the adhesive layers. This allows the adhesive bond state monitoring functionality to be embedded within the existing adhesive system, achieving precise measurement without proportionally increasing overall device complexity.
Solution Approach 2:
The adhesive elements serve multiple functions: they provide the bonding function and simultaneously house or support the sensor arrangement for monitoring bond state. This multi-functionality reduces the need for separate monitoring components, thereby limiting the increase in device complexity while maintaining high measurement precision.
2Measurement precision
If multiple sensors are used to detect alignment and bond strength, then measurement precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
The sensor arrangement is pre-integrated into the adhesive elements during the adhesive manufacturing process, before the adhesive is applied to form the bond. This preliminary integration simplifies the overall manufacturing process by eliminating separate sensor installation steps and ensuring proper sensor positioning from the outset.
Solution Approach 2:
The manufacturing processes for the adhesive elements and the sensor arrangement are combined into a single integrated production flow. This merging of processes reduces the number of discrete manufacturing steps and simplifies quality control, thereby improving ease of manufacture while maintaining the capability to detect multiple bond parameters with high precision.
3Reliability
If real-time monitoring of adhesive bond is implemented, then reliability of connection system is improved, but use of energy increases
Solution Approach 1:
Instead of continuous monitoring, the sensor arrangement performs periodic measurements of the adhesive bond state at critical stages (during application, immediately after bonding, and at scheduled intervals). This periodic action maintains system reliability by detecting bond degradation when it occurs, while significantly reducing energy consumption compared to continuous monitoring.
Solution Approach 2:
The system implements feedback mechanisms where sensor data is processed and used to trigger alerts or actions only when bond state parameters exceed predefined thresholds. This feedback approach ensures high reliability by immediately responding to actual bond degradation events while minimizing unnecessary energy consumption from continuous data processing and transmission.
Data Source
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AI summary
The invention relates to a method (100) for determining the state of a connection system (10) comprising a first adhesive (12), a second adhesive (14), and a sensor arrangement (16). The method (100) can be used, in particular, to determine the position of the adhesives (12, 14) relative to each other, wherein the first adhesive (12) is brought close to and/or attached to the second adhesive (14), and at least one parameter relating to the positioning is detected by the sensor arrangement (16). After the adhesives (12, 14) have been aligned, they can be finally attached (or reattached, if necessary). The method (100) can also be used, in particular, to detect the adhesion of the first adhesive (12) to the second adhesive (14) and/or to determine the load or lack thereof in an adhesive connection.In a preferred embodiment of the method (100), processed and/or unprocessed sensor data can be transmitted wirelessly by means of a communication component (18). The invention further relates to a connection system (10) configured for carrying out the aforementioned method (100) (possibly including embodiments of this method (100)) and a set (1) comprising the connection system (10) and a functional element, in particular a mobile communication router (11). The invention also relates to a method (200) for manufacturing the aforementioned connection system (10).