Adhesive-Bonded Attachment Device for Aerospace
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current attachment methods for system components in aerospace applications, such as mechanical fasteners, are labor-intensive and create stress concentrations and quality assurance issues due to drilling holes and the need for separate clamping fixtures during adhesive bonding.
Innovation Solution
An adhesive-bonded attachment device utilizing a two-phase adhesive system with a mounting base featuring a structural adhesive and a pressure-sensitive adhesive, where the pressure-sensitive adhesive applies continuous positive pressure to the structural adhesive, eliminating the need for separate clamping fixtures and reducing labor-intensive processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If mechanical fasteners are used to attach components to aircraft structures, then the attachment strength is improved, but the process becomes labor-intensive and creates stress concentrations due to drilling holes
Solution Approach 1:
The patent replaces mechanical fastening systems (drilling and bolting) with an adhesive bonding system. The attachment device uses structural adhesive applied to a mounting base to bond components to aircraft structures, eliminating the need for drilling holes and using mechanical fasteners, thereby reducing labor intensity while maintaining attachment strength
Solution Approach 2:
The patent changes the bonding mechanism from mechanical (physical interlocking through holes) to chemical (adhesive bonding). This parameter change in the attachment method eliminates stress concentrations associated with drilled holes while providing sufficient bonding strength through the adhesive material
2Object-affected harmful factors
If adhesive bonding is used to attach components, then stress concentrations are reduced, but the process becomes labor-intensive requiring separate clamping fixtures
Solution Approach 1:
The patent merges the clamping function into the attachment device itself. The mounting base is designed with integrated clamping features that apply pressure to the adhesive bond line during curing, eliminating the need for separate external clamping fixtures and simplifying the overall bonding process
Solution Approach 2:
The attachment device is self-clamping, meaning it incorporates its own pressure application mechanism. The mounting base structure itself provides the clamping force needed to maintain adhesive pressure during curing, making the system self-sufficient and eliminating additional equipment requirements
3Reliability
If separate clamping fixtures are used during adhesive bonding, then the bonding quality is improved, but the process time and labor requirements increase
Solution Approach 1:
The mounting base is pre-configured with integrated clamping features and adhesive application surfaces before the bonding operation. This preliminary preparation allows the device to self-clamp and maintain bonding pressure without requiring additional time for setting up separate clamping fixtures during the actual bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid, accurate, and stress-free attachment of components to aircraft structures, reducing labor and improving quality assurance by maintaining constant pressure on the structural adhesive during curing.
Implementation Method 1
a pressure-sensitive adhesive disposed on the mounting surface, wherein the pressure-sensitive adhesive and a portion of the mounting surface define a cavity
Implementation Method 2
a structural adhesive disposed on the mounting surface, wherein the structural adhesive and the pressure-sensitive adhesive define a bonding surface configured to be bonded to a contact surface of a structure
Data Source
AI summary
An adhesive-bonded attachment device includes a mounting base including a mounting surface, a structural adhesive disposed on the mounting surface, and a pressure-sensitive adhesive disposed on the mounting surface bordering the structural adhesive, wherein the structural adhesive and the pressure-sensitive adhesive define a bonding surface configured to be bonded to a contact surface of a structure, and an attachment feature disposed on said mounting base.