Adhesive Bonding for Optical Light Guide Elements
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Solution Overview
Problem
In the manufacturing of high-precision optical light guide elements, the use of adhesives to attach flat surfaces can introduce small air bubbles or voids, reducing mechanical robustness and risk contamination of optically sensitive components.
Innovation Solution
A method involving the deposition of a high-viscosity adhesive pattern around specific areas on a surface, followed by jetting a lower-viscosity adhesive onto those areas, which is then cured, helps prevent bubble formation and overflow onto sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to attach surfaces together, then surfaces are fixed to one another, but small air bubbles or bonding voids are introduced into the adhesive reducing mechanical robustness
Solution Approach 1:
The adhesive application process is segmented into two distinct stages: first applying a high-viscosity adhesive to establish the bond pattern, then jetting a lower-viscosity adhesive to fill remaining voids and displace air bubbles. This segmentation allows each adhesive type to perform its specific function optimally, resolving the contradiction between achieving strong bonds and eliminating voids.
Solution Approach 2:
The high-viscosity adhesive is applied first to create a preliminary bond structure that defines the attachment pattern. This preliminary action establishes the framework before the second adhesive is introduced, allowing systematic elimination of air bubbles while maintaining the intended bond geometry.
2Strength
If surfaces are pressed together during adhesive attachment, then bonding is achieved, but adhesive overflows onto optically sensitive components causing contamination
Solution Approach 1:
The adhesive application uses local quality by applying different viscosities of adhesive to different regions of the bonding surface. The high-viscosity adhesive is applied to areas requiring structural bond strength, while the lower-viscosity adhesive is jetted specifically into regions prone to void formation. This localized differentiation prevents overflow onto sensitive components while ensuring adequate bonding throughout.
Solution Approach 2:
The invention changes the viscosity parameter of the adhesive material between different application regions and stages. By using high-viscosity adhesive first (resistant to overflow) and then supplementing with low-viscosity adhesive (easily jetted to fill voids), the process optimizes both bonding strength and contamination prevention through parameter variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances mechanical robustness by minimizing bonding voids and prevents adhesive contamination, improving the reliability and cleanliness of the attachment process.
Implementation Method 1
depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive
Implementation Method 2
jetting a second adhesive onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive
Implementation Method 3
curing the first and second adhesives
Data Source
AI summary
The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.