Bonding Method for Adhesive Uniformity in Substrate Step Portions
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Solution Overview
Problem
The existing bonding methods face challenges in ensuring that the adhesive layer is uniformly embedded into the step portions of substrates, leading to potential bonding defects due to uneven pressure distribution during the bonding process.
Innovation Solution
A bonding method that includes a pressing step followed by a pressure adjusting step, where the substrate and support are placed in an environment with higher pressure than the initial pressing step, allowing the adhesive layer to flow uniformly into the step portions of the substrate, preventing bonding defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a pressing method is used to bond substrate and support through adhesive layer, then bonding strength is improved, but adhesive layer cannot uniformly flow into step differences of substrate leading to bonding defects
Solution Approach 1:
The patent applies preliminary action by performing the pressing step first to establish initial bonding, then subsequently applying higher pressure in the pressure adjusting step to enable the adhesive layer to uniformly flow into the step differences of the substrate. This sequential approach ensures both bonding strength and adhesive uniformity are achieved.
Solution Approach 2:
The patent changes the pressure parameter from the initial pressing pressure to a higher pressure in the pressure adjusting step. This parameter change enables the adhesive layer to sufficiently flow into the step differences while maintaining bonding strength, resolving the contradiction between strength and uniformity.
2Manufacturing precision
If higher pressure is applied during pressing to improve adhesive embedding, then adhesive layer embedding is improved, but substrate may deform or crack
Solution Approach 1:
The pressing step serves as a preliminary action that establishes initial bonding at a moderate pressure level, preparing the substrate and adhesive for the subsequent higher pressure application. This prevents substrate damage while enabling proper adhesive embedding.
Solution Approach 2:
The patent employs a dynamic pressure application strategy where pressure is first applied at a moderate level during pressing, then increased to a higher level during the pressure adjusting step. This dynamic approach allows the substrate to adapt to pressure changes, preventing deformation or cracking while achieving proper adhesive embedding.
Data Source
AI summary
A bonding method which includes a pressing step of bonding a substrate and a support plate for supporting the substrate to each other through an adhesive layer and pressing the bonded substrate and support plate using a plate member; and, after the pressing step, a pressure adjusting step of placing the substrate and the support plate bonded to each other through the adhesive layer in an environment having higher pressure than pressure of an environment in which the pressing step is performed.