Adhesive-Bonded Bridge Cavities for Dense Microelectronic Interconnects
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Solution Overview
Problem
Conventional microelectronic packages face limitations in interconnect density, signal transfer speed, and miniaturization due to costly and complex manufacturing operations required for high-density interconnects.
Innovation Solution
The use of a microelectronic structure with a substrate and a bridge component in a cavity, where the bridge component is coupled to the substrate using an adhesive, allowing for higher interconnect density without the need for expensive manufacturing operations like fine-pitch via formation and first-level interconnect plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional solder attachment methods are used to attach die to organic package substrate, then manufacturing simplicity is maintained, but interconnect density is limited
Solution Approach 1:
The substrate is divided into multiple cavities, each capable of holding a bridge component. This segmentation allows multiple interconnect structures to be formed in parallel within the same substrate, significantly increasing interconnect density without proportionally increasing manufacturing complexity
Solution Approach 2:
Bridge components are nested within cavities of the substrate, creating a compact three-dimensional structure. This nesting approach allows additional interconnect structures to be incorporated within the existing substrate footprint, increasing density without requiring larger manufacturing areas
2Quantity of substance
If high interconnect density is achieved through conventional methods, then signal transfer speed may improve, but manufacturing cost increases due to fine-pitch via formation and plating
Solution Approach 1:
The invention extracts and eliminates the need for fine-pitch via formation and first-level interconnect plating operations by using bridge components with pre-formed conductive structures. This extraction of complex manufacturing steps significantly reduces manufacturing cost while maintaining high interconnect density
Solution Approach 2:
The bridge components serve as disposable interconnect structures that are attached once and then serve their function without requiring additional complex manufacturing steps. This approach replaces expensive, complex manufacturing operations with simpler, more cost-effective processes
3Volume of moving object
If conventional package structures are used, then manufacturing simplicity is maintained, but miniaturization is limited
Solution Approach 1:
The invention transitions from two-dimensional planar interconnect structures to three-dimensional structures by placing bridge components within cavities. This dimensional change allows multiple interconnect paths to be stacked vertically, reducing the horizontal footprint and enabling miniaturization without significantly increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high interconnect densities comparable to conventional methods without the associated costs and complexities, providing flexibility in design and manufacturing while reducing expenses.
Implementation Method 1
the bridge component is coupled to the substrate using an adhesive
Data Source
AI summary
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.