Adhesive Assembly with Buffer Region for Flexible Display Stress Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible display modules face excessive bending stress due to multilayered film structures and optical adhesives, leading to potential adhesive stripping and functional damage.
Innovation Solution
An adhesive assembly with a bonding region and a bending load buffer region is introduced, featuring through holes with lubricant fillers to reduce bending stress, where the filler contacts the modules and disperses stress, and the adhesive base layer is patterned to create distinct bonding and buffer regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If optical adhesive is used to bond functional films together, then bonding strength is improved, but bending stress increases
Solution Approach 1:
The adhesive base layer is segmented into bonding regions and bending load buffer regions through through holes. The bonding regions provide strong adhesion while the buffer regions (with through holes) reduce bending stress, resolving the contradiction between bonding strength and bending stress
Solution Approach 2:
Different regions of the adhesive base layer have different properties: bonding regions have high adhesive strength for strong bonding, while bending load buffer regions have reduced adhesive content (through holes) to minimize bending stress. This local differentiation resolves the contradiction between bonding strength and bending stress
2Stress or pressure
If through holes are added to create bending load buffer region, then bending stress is reduced, but bonding strength decreases
Solution Approach 1:
The adhesive base layer is divided into bonding regions (without through holes) and bending load buffer regions (with through holes). This segmentation allows the bonding regions to maintain strong adhesive bonds while the buffer regions reduce bending stress, resolving the contradiction between bonding strength and bending stress reduction
Solution Approach 2:
The adhesive base layer has non-uniform structure with bonding regions providing strong adhesion and buffer regions providing stress relief. This local quality differentiation ensures that bonding strength is maintained where needed while bending stress is reduced where applicable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces bending stress in flexible modules, minimizing adhesive stripping and functional damage, while allowing for flexible module design and operation.
Implementation Method 1
a material of the bending load buffer region comprises a filler having lubrication characteristics
Data Source
AI summary
This disclosure relates to the field of display technologies, and in particular to an adhesive assembly, a flexible module, a display device and a manufacturing method of a flexible module. The adhesive assembly includes an adhesive base layer, which is arranged between two modules. The adhesive base layer includes a bonding region and a bending load buffer region, the bonding region being used for bonding the two modules, and a bending stress in the bending load buffer region being smaller than that in the bonding region. When two modules are bonded by such an adhesive assembly, the bending stress in the bending load buffer region and corresponding module portion is smaller than that in the bonding region and corresponding module portion for the whole flexible module, which reduces bending stress in the modules as a whole and facilitates spread and application of the flexible module.