Adhesive Carrier Frame for Molding Brittle Substrates
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Solution Overview
Problem
Existing molding techniques for electronic devices on brittle substrates, such as ceramic substrates, often result in substrate cracking due to excessive clamping pressure during compression molding, leading to unsatisfactory yields and increased breakage.
Innovation Solution
A method involving a substrate carrier with an adhesive film and a frame that surrounds the substrate, allowing the substrate to be clamped at a specific area while the electronic devices are molded in cavities, reducing direct clamping force on the substrate and using a dome-shaped insert to distribute pressure evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If compression molding is used to mold multiple LED devices simultaneously, then productivity is improved, but the brittle ceramic substrate may crack due to excessive clamping pressure
Solution Approach 1:
The clamping area is segmented into a frame structure that surrounds the substrate panel. The frame is clamped at discrete locations rather than the entire substrate surface, distributing the clamping force and preventing crack propagation across the brittle substrate while still enabling simultaneous molding of multiple devices.
Solution Approach 2:
The frame acts as an intermediary structure between the clamping mechanism and the substrate. Instead of clamping the brittle substrate directly, the frame mediates the clamping force, protecting the substrate from direct mechanical stress that would cause cracking.
2Force
If direct clamping is applied to the substrate during molding, then molding pressure is effectively applied, but the substrate breaks due to excessive stress
Solution Approach 1:
The clamping force is applied locally at the frame structure rather than uniformly across the entire substrate. The frame is designed to concentrate and distribute the clamping force at specific locations, providing effective molding pressure transmission while avoiding excessive stress on the brittle substrate areas.
3Reliability
If individual LED devices are molded separately, then substrate breakage is minimized, but productivity decreases due to sequential processing
Solution Approach 1:
Multiple LED devices mounted on a single substrate panel are molded simultaneously in one compression molding operation. The frame structure enables this combined processing by providing a unified clamping mechanism that secures the entire substrate panel while allowing all devices on that panel to be molded at the same time, thereby improving productivity without compromising yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces substrate breakage and increases productivity by allowing simultaneous molding of multiple electronic devices while minimizing clamping-induced damage to brittle substrates.
Implementation Method 1
providing a carrier comprising a frame including an adhesive film; mounting the substrate onto the adhesive film of the carrier
Data Source
AI summary
A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant.