Temporary Adhesive Cleaning Fluid for Residue-Free Substrates
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Solution Overview
Problem
Existing cleaning solutions for temporary adhesive layers on semiconductor substrates after grinding and TSV formation are inadequate in terms of detergency, leaving residues that are difficult to remove effectively.
Innovation Solution
A cleaning solution comprising tetrabutylammonium fluoride, dimethyl sulfoxide, and a liquid compound with a solubility parameter of 8.0 to 10.0 and containing a heteroatom, specifically ketone or ester groups, is used to effectively remove silicone-based adhesives from substrate surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning solutions containing quaternary ammonium salt, water, and organic solvent are used, then the substrate can be cleaned, but the detergency for temporary adhesive layer is insufficient and residues remain
Solution Approach 1:
The patent changes the chemical composition parameters of the cleaning solution by introducing tetrabutylammonium fluoride and specifically selecting liquid compounds with solubility parameters of 8.0-10.0 (ketone or ester groups), which significantly improves the dissolution and removal of silicone-based temporary adhesives compared to conventional cleaning solutions
Solution Approach 2:
The cleaning solution combines multiple components (tetrabutylammonium fluoride, dimethyl sulfoxide, and specific liquid compounds with ketone or ester groups) in a composite formulation that synergistically enhances detergency for temporary adhesive layers while maintaining substrate integrity
2Manufacturing precision
If strong cleaning agents are used to remove adhesive, then detergency improves, but substrate damage risk increases
Solution Approach 1:
The patent carefully controls the concentration ranges of each component (tetrabutylammonium fluoride: 1-15 mass%, dimethyl sulfoxide: 5-30 mass%, liquid compound: 60-80 mass%) to achieve optimal cleaning effectiveness while preventing substrate damage through balanced chemical action
Solution Approach 2:
The cleaning solution acts as an intermediary that selectively dissolves the temporary adhesive layer through its specific chemical composition without attacking the substrate, enabling complete adhesive removal while protecting the semiconductor substrate from damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning solution provides excellent detergency, ensuring complete removal of temporary adhesive layers without damaging the substrate, thereby preparing it for further semiconductor processing steps.
Implementation Method 1
The cleaning solution contains tetrabutylammonium fluoride, which acts as a solvating agent to dissolve the silicone-based temporary adhesive layer on the substrate surface
Implementation Method 2
Dimethyl sulfoxide in the cleaning solution provides enhanced solvation capability for the temporary adhesive, leveraging its polar aprotic characteristics to improve detergent action
Implementation Method 3
The liquid compound has a solubility parameter of 8.0 or more and 10.0 or less and has a heteroatom; wherein the solubility parameter is defined in the regular solution theory introduced by Hildebrand and Scott
Data Source
Figure 1
AI summary
A cleaning solution for temporary adhesive for substrates contains: tetrabutylammonium fluoride; dimethyl sulfoxide; and a liquid compound having a solubility parameter of 8.0 or more and 10.0 or less and having a heteroatom. The tetrabutylammonium fluoride is preferably contained at a content of 1 mass% or more and 15 mass% or less in 100 mass% of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound. The dimethyl sulfoxide is preferably contained at a content of 5 mass% or more and 30 mass% or less in 100 mass% of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound.