Adhesive Polymer Cleaning Composition With Stable Fluoride Etch Rate

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Solution Overview

Problem

Existing cleaning agents for adhesive polymers, particularly those using fluorine compounds like TBAF, face challenges with long-term storage stability and etch rate degradation due to reactions with ketone or ester solvents, leading to decreased reactivity and efficiency over time.

Innovation Solution

A composition combining quaternary alkylammonium fluoride with specific aprotic solvents, such as N-substituted amides and ethers, is used to maintain high affinity for adhesive surfaces and prevent reaction-induced degradation, ensuring a high etch rate and long-term storage stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If TBAF is dissolved in ketone or ester solvents to achieve high etch rate, then the cleaning agent shows high initial etch performance, but the etch rate decreases over time due to reaction between TBAF and the solvent

Engineering Contradiction:
Improveetch rateVSAvoidstorage stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent changes the chemical parameters of the solvent system by selecting specific aprotic solvents (cyclic carbonates, chain carbonates, cyclic carboxylic acid esters) with particular molecular structures and properties. These parameter changes prevent the harmful reaction between TBAF and the solvent while maintaining high etch rate, thus resolving the contradiction between productivity and reliability.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If TBAF concentration is increased to maintain high etch rate, then cleaning effectiveness is improved, but cost and environmental burden increase

Engineering Contradiction:
Improveetch rateVSAvoidfluorine compound concentration
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The patent optimizes the concentration parameter of TBAF by combining it with specific aprotic solvents that enhance the etching efficiency. This allows achieving high etch rates at lower TBAF concentrations, thus reducing the quantity of fluorine compounds needed while maintaining cleaning effectiveness.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If conventional solvents are used to dissolve TBAF, then the cleaning agent can be prepared easily, but the reactivity of fluoride ion decreases due to solvation and hydrogen bonding

Engineering Contradiction:
Improvesolvent availabilityVSAvoidfluoride ion reactivity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the chemical parameters of the solvent by selecting aprotic solvents with specific molecular structures (cyclic carbonates, chain carbonates, cyclic carboxylic acid esters) that do not form strong hydrogen bonds with fluoride ions. This maintains high fluoride ion reactivity while ensuring easy preparation and handling of the cleaning agent.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves a high etch rate with long-term storage stability, even at low fluorine compound concentrations, improving performance and reducing costs by preventing corrosion and maintaining effectiveness over time.

Implementation Method 1

Since a fluoride ion of TBAF participates in the cleavage of an Si—O bond via Si—F bond formation, the cleaning agent can be provided with etch performance.

Methodology Applied
Scientific EffectSi-O bond cleavage via Si-F bond formation: Chemical Bonding

Implementation Method 2

Since the polar aprotic solvent can dissolve TBAF and does not form solvation via a hydrogen bonding with the fluoride ion, the reactivity of the fluoride ion can be increased.

Methodology Applied
Scientific EffectSolvation: Solvation

Data Source

PatentUS11807837B2Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer
Publication Date: 2023.11.07 RESONAC CORP
  • US11807837B2 patent drawing
  • US11807837B2 patent drawing
  • US11807837B2 patent drawing

AI summary

Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.