Adhesive Composition for CMOS Image Sensors
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Solution Overview
Problem
The challenge is to develop an adhesive composition that achieves excellent transparency and viscosity for semiconductor devices, particularly for optical parts like CMOS image sensors, while ensuring high refractive index and peeling resistance during reflow processes.
Innovation Solution
The adhesive composition comprises a (meth)acrylic polymer, a compound with at least two (meth)acryloyl groups, a polymerization initiator, and a filler, with specific components and ratios to enhance transparency, viscosity, and heat resistance, and includes an epoxy group for improved adhesion to inorganic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive composition is used to bond glass substrate and semiconductor substrate, then bonding strength is achieved, but optical transparency deteriorates due to light scattering and absorption
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific ratios of (meth)acrylic polymer, compound with (meth)acryloyl groups, and filler particles. This compositional parameter adjustment enables the cured adhesive to achieve both high bonding strength and excellent optical transparency by optimizing the molecular structure and reducing light scattering mechanisms.
Solution Approach 2:
The patent creates a composite adhesive material combining organic polymer components with inorganic filler particles. This composite structure provides synergistic effects where the polymer matrix ensures bonding strength while the filler composition and distribution control optical properties, achieving both mechanical and optical performance requirements.
2Productivity
If adhesive composition is applied to limited narrow area at high speed, then productivity is improved, but viscosity control becomes difficult
Solution Approach 1:
The patent adjusts viscosity parameters through controlled selection of polymer molecular weight, crosslinking density, and filler content. The specific composition ratios and molecular weight ranges enable the adhesive to maintain optimal viscosity for high-speed dispensing while ensuring precise application to narrow areas without spreading or sagging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a cured article with excellent transparency, high refractive index, and superior peeling resistance during reflow processes, making it suitable for optical parts and semiconductor devices, including CMOS image sensors.
Implementation Method 1
an adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator
Implementation Method 2
includes an epoxy group for improved adhesion to inorganic materials
Data Source
AI summary
An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.