Adhesive Coating on Conductive Substrates to Prevent Short Circuits
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Solution Overview
Problem
Conductive substrates used in light-emitting devices face issues such as poor aesthetic appearance, low electrical conductivity, and short circuits due to the spread of adhesive during the bonding process of circuit elements, which is not effectively addressed by existing methods.
Innovation Solution
The method involves setting the amounts and positions of conductive and non-conductive adhesives based on the size and number of electrodes, using an adhesive-discharging device with a nozzle positioned at calculated center points, and applying adhesives in controlled amounts and times to prevent adhesive spread and ensure proper bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied in large amounts to ensure proper bonding, then bonding strength is improved, but adhesive spreads causing short circuits and poor aesthetic appearance
Solution Approach 1:
The patent applies different adhesive types (conductive vs. non-conductive) to different local areas based on their specific functional requirements. Conductive adhesive is applied only to electrode areas requiring electrical connection, while non-conductive adhesive is applied to insulation areas. This localized quality differentiation ensures proper bonding strength where needed while preventing short circuits through insulation where required.
Solution Approach 2:
The bonding process is segmented into distinct stages: first applying conductive adhesive to electrode positions, then applying non-conductive adhesive to insulation positions. The adhesive application is also segmented by position (center points of electrodes) and controlled by separate discharge operations for different adhesive types, preventing mixing and unwanted spread.
2Area of stationary object
If adhesive is applied to cover all electrode areas, then bonding coverage is improved, but adhesive contact causes short circuits between conductive elements
Solution Approach 1:
Different adhesive properties are assigned to different spatial locations: conductive adhesive for electrode contact areas and non-conductive adhesive for insulation areas. This ensures complete bonding coverage across all electrode positions while maintaining electrical insulation between adjacent conductive elements through the strategic placement of non-conductive adhesive.
3Quantity of substance
If adhesive discharge amount is increased to ensure complete bonding, then bonding completeness is improved, but adhesive flows out of bonding areas reducing aesthetic appearance
Solution Approach 1:
The patent performs preliminary positioning by setting center points for each electrode before adhesive application. The adhesive discharge amount and position are pre-calculated based on electrode size and spacing, allowing precise control of adhesive placement within bonding areas without excessive flow or spillage that would compromise aesthetic appearance.
Solution Approach 2:
The adhesive discharge parameters (amount, speed, position) are optimized and adjusted based on specific electrode characteristics such as size, spacing, and material properties. This parameter optimization ensures sufficient adhesive quantity for complete bonding while preventing overflow that would affect the visual appearance of the conductive substrate.
Data Source
AI summary
Disclosed is a method of coating a conductive substrate with an adhesive, wherein the amounts and positions of conductive and non-conductive adhesives for bonding a plurality of circuit elements to the conductive substrate are set, thus preventing the spread of the adhesive from causing defects, including a poor aesthetic appearance, low electrical conductivity, and short circuits.