Adhesive Composition for Organic Electronic Device Moisture Barrier
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Solution Overview
Problem
Organic electronic devices (OEDs), such as OLEDs, are sensitive to moisture and oxygen, leading to durability issues due to the oxidation of organic materials and metal electrodes, especially under high-temperature and high-humidity conditions, and existing adhesive encapsulation methods lack reliability and processability.
Innovation Solution
An adhesive composition comprising an olefin-based resin with a low water vapor transmission rate (WVTR) and a combination of heat-curable and photocurable resins, which provides a moisture barrier and excellent durability by controlling fluidity through a double curing method, ensuring effective encapsulation of OEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a polyisobutylene (PIB)-based pressure-sensitive adhesive is used for encapsulation, then the adhesive can be applied easily, but it has low reliability under high-temperature and high-humidity conditions and lacks high processability
Solution Approach 1:
The patent uses a composite adhesive composition comprising polyisobutylene (PIB) as the base adhesive combined with a silane crosslinking agent. This composite structure allows the adhesive to maintain its ease of application while gaining enhanced reliability under high-temperature and high-humidity conditions through crosslinking-induced improvements in adhesion strength and moisture resistance.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the PIB adhesive by introducing a silane crosslinking agent. This changes the adhesive's molecular structure from linear to crosslinked, thereby improving its thermal stability, adhesion strength, and resistance to moisture penetration under high-temperature and high-humidity conditions while maintaining processability.
2Reliability
If an adhesive composition with low water vapor transmission rate is used to block moisture and oxygen, then the durability of OED is improved, but the processability and handleability may be affected
Solution Approach 1:
The patent applies the adhesive composition in a liquid or paste state before crosslinking, allowing for easy application and positioning. The crosslinking process is then initiated subsequently (either by heat, moisture, or catalyst), transforming the adhesive into a crosslinked gel that provides low water vapor transmission rate and blocks moisture and oxygen, thus achieving both ease of manufacture and improved durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively blocks moisture and oxygen, maintaining the structural integrity and reliability of OEDs under high-temperature and high-humidity conditions while allowing for excellent handleability and processability, enhancing the durability and reliability of OEDs.
Implementation Method 1
an adhesive composition, which can form a structure for effectively blocking moisture or oxygen flowing into an OED from the outside
Implementation Method 2
an olefin-based resin having a water vapor transmission rate (WVTR) of 50 g/m2·day or less
Implementation Method 3
the adhesive composition exhibits a shear strength when crosslinked or cured under the following conditions. The specimen is irradiated with light having the UV-A wavelength range
Implementation Method 4
exhibit excellent durability by controlling fluidity through a double curing method, ensuring effective encapsulation of OEDs
Data Source
AI summary
Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.