Adhesive Composition for Optical Bonding with Resin Particles
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Solution Overview
Problem
Conventional adhesives used for bonding optical and electronic components, such as epoxy resin-based adhesives, tend to shrink during curing, leading to horizontal distortion and shifting of the optical axis, and their adhesion force is reduced over time due to moisture and deformation, causing displacement issues.
Innovation Solution
Incorporating resin particles with a specific recovery rate of 30% or less and controlling moisture permeability to 90 g/m2-24 h or less in the adhesive composition, which includes silicone particles, to form a stable adhesive layer that maintains high adhesion after reliability testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin-based adhesive is used for bonding optical components, then adhesion strength is improved, but the adhesive shrinks during curing causing horizontal distortion and optical axis shifting
Solution Approach 1:
The patent changes the physical and chemical parameters of the adhesive by incorporating resin particles with specific properties (recovery rate of 30% or less, specific modulus of elasticity, specific glass transition temperature). These parameter changes enable the adhesive to maintain adhesion strength while reducing shrinkage-induced distortion and optical axis shifting during curing.
Solution Approach 2:
The patent creates a composite adhesive material by combining resin particles with specific characteristics (low recovery rate, controlled modulus of elasticity, controlled glass transition temperature) with the adhesive base. This composite structure provides both strong adhesion and minimal shrinkage deformation, resolving the contradiction between strength and precision.
2Strength
If conventional adhesive is used for bonding, then initial adhesion force is sufficient, but adhesion force degrades over time under moisture influence and deformation
Solution Approach 1:
The patent modifies the adhesive's resistance to moisture and deformation by selecting resin particles with specific glass transition temperatures and recovery rates. These parameter changes ensure the adhesive maintains its adhesion force over time even when exposed to moisture and mechanical stress, significantly improving reliability.
Solution Approach 2:
The patent incorporates resin particles with low recovery rate (30% or less) that act as a cushioning mechanism against moisture-induced swelling and thermal stress. These particles beforehand prepare the adhesive structure to resist degradation, preventing adhesion force loss over time under environmental influence.
3Manufacturing precision
If adhesive layer is made thinner to reduce distortion, then optical axis stability is improved, but adhesion reliability is reduced
Solution Approach 1:
The patent changes the material parameters of the adhesive by incorporating resin particles with specific modulus of elasticity and recovery rate characteristics. This allows the adhesive layer to maintain adequate thickness for reliable adhesion while the low-shrinkage properties ensure optical axis stability, resolving the trade-off between thickness, precision, and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively suppresses shape deformation and maintains high adhesion, making it suitable for precise optical and electronic components, including pressure sensors, by providing a stress-relief effect and low moisture permeability.
Implementation Method 1
the resin particles having a recovery rate of 30% or less
Implementation Method 2
a cured product with a thickness of 250±50 μm obtained from the composition for bonding having a moisture permeability of 90 g/m2-24 h or less
Data Source
AI summary
Provided is a composition for bonding that forms, after bonding, an adhesive layer that is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test; also provided are an optical adhesive and an adhesive for pressure sensors, both of which comprise the composition. The composition for bonding comprises resin particles. The resin particles have a recovery rate of 20% or less, and a cured product of the composition with a thickness of 250±50 μm has a moisture permeability of 90 g/m2-24 h or less. An adhesive layer formed from the composition for bonding is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test.