Adhesive Composition for Semiconductor Wafer Stripping
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Solution Overview
Problem
Existing adhesive compositions for semiconductor wafers require a release layer to facilitate the separation of supports from substrates, which complicates the process and increases handling difficulties due to the need for light-induced quality changes in the release layer.
Innovation Solution
A new adhesive composition incorporating a thermoplastic resin and a release agent, allowing for the temporary attachment and easy stripping of supports from substrates without the need for a release layer, utilizing a thermoplastic resin with a glass transition temperature range of −60° C. to 200° C. and a release agent like silicone to adjust adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a release layer is formed on the support to enable stripping, then the support can be separated from the substrate, but the process complexity increases and handling becomes more difficult
Solution Approach 1:
The invention extracts the release function from a separate release layer and integrates it directly into the adhesive composition. The adhesive composition contains a release agent that provides release properties without requiring a distinct release layer structure, thereby simplifying the laminate structure while maintaining the ability to strip the support easily
Solution Approach 2:
The invention merges the adhesive function and release function into a single adhesive composition. The adhesive composition simultaneously provides bonding capability (through the thermoplastic resin) and release capability (through the incorporated release agent), eliminating the need for separate functional layers and reducing overall process complexity
2Ease of operation
If a release layer is used for support separation, then stripping is enabled, but handling difficulties increase due to light-induced quality changes
Solution Approach 1:
The invention extracts the light-sensitive release mechanism from the system and replaces it with a thermal release mechanism. The release agent in the adhesive composition responds to heat rather than light, eliminating the need for light-induced quality changes and simplifying the handling process
Solution Approach 2:
The invention changes the activation parameter for release from light (in the case of traditional release layers) to heat (in the case of the adhesive composition with release agent). This parameter change simplifies the stripping process by eliminating the need for light irradiation equipment and associated handling complexities
3Strength
If high adhesive properties are used to prevent substrate and support separation, then bonding strength is improved, but stripping becomes difficult without a release layer
Solution Approach 1:
The invention creates local quality differentiation within the adhesive composition by incorporating a release agent that creates a release interface. The adhesive composition maintains strong bonding properties through the thermoplastic resin while simultaneously providing a release interface through the release agent, enabling both strong bonding and easy stripping
Solution Approach 2:
The invention uses a composite adhesive composition combining a thermoplastic resin (for adhesive strength) and a release agent (for release properties). This composite material simultaneously provides both bonding and release functions, resolving the contradiction between maintaining strong adhesive strength and enabling easy stripping
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of a laminate where the support can be easily stripped from the substrate, simplifying the process and reducing handling challenges by eliminating the need for a light-sensitive release layer, while maintaining adequate adhesive strength and heat resistance.
Implementation Method 1
utilizing a thermoplastic resin with a glass transition temperature range of −60° C. to 200° C.
Implementation Method 2
a release agent like silicone to adjust adhesive properties
Data Source
AI summary
An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.