Adhesive Bond Curing With Local Heating to Preserve Alignment
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Solution Overview
Problem
Adhesive shrinkage during curing causes misalignment of lighting components in motor vehicle lighting devices, leading to undesirable changes in the light effect, especially when using different materials and oven heating induces thermal deformation.
Innovation Solution
A method involving targeted, local heating of the adhesive using laser radiation or focused infrared radiation to cure the adhesive without heating the components, ensuring precise alignment and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If oven heating is used to cure the adhesive, then the adhesive is cured and achieves required strength, but the components are subjected to thermal deformation and misalignment occurs
Solution Approach 1:
The heating process is segmented into localized zones rather than uniform oven heating. The laser or infrared radiator heats only the adhesive in the bond line, while the components remain at ambient temperature, preventing thermal deformation and maintaining alignment precision.
Solution Approach 2:
The heating method applies local quality by concentrating thermal energy only where needed (in the adhesive) rather than heating the entire assembly. This selective heating ensures the adhesive cures while the components experience minimal thermal exposure, preserving their dimensional stability and alignment.
2Reliability
If oven heating is used to cure the adhesive, then the adhesive is cured, but energy consumption increases due to heating the entire assembly
Solution Approach 1:
The heating process is segmented into localized zones rather than uniform oven heating. The laser or infrared radiator heats only the adhesive in the bond line, while the components remain at ambient temperature, preventing thermal deformation and maintaining alignment precision.
Solution Approach 2:
Instead of applying excessive heat to the entire assembly, the method uses partial action by heating only the specific region containing the adhesive. This reduces the total energy input required for curing while achieving the same adhesive strength.
3Strength
If adhesive shrinkage occurs during curing, then the adhesive bonds the components, but misalignment of lighting components occurs
Solution Approach 1:
The curing method changes the thermal parameters from high-temperature oven heating to controlled localized heating at lower temperatures. This parameter change reduces adhesive shrinkage while maintaining bond strength, thereby preserving alignment precision of the lighting components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves precise adhesive bonding without thermal deformation, maintaining component alignment and reducing energy consumption.
Implementation Method 1
The introduction of heat takes place through the exposed adhesive surface and radiation absorption in the adhesive
Implementation Method 2
the introduced heat is also distributed in the adhesive volume through thermal conduction and convection
Implementation Method 3
the introduced heat is also distributed in the adhesive volume through thermal conduction and convection
Data Source
AI summary
A method for producing an adhesive connection between a first component and a second component, wherein the first component has at least one cavity and the second component has at least one pin, The cavity is at least partially filled with an adhesive, and the components are aligned relative to one another such that at least sections of the pin project into the adhesive inside the cavity. A heating that is limited to the adhesive is carried out by means of a targeted, local introduction of heat into the adhesive in order to cure the adhesive.