Selective Adhesive Drum Transfer for Accurate Device Chip Placement
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Solution Overview
Problem
Existing methods for manufacturing electronic devices, such as display apparatuses using LEDs, face challenges in transferring fine device chips onto substrates with high accuracy and efficiency, leading to yield degradation, increased costs, and prolonged tact times due to issues with separation forces, distortion, and positioning accuracy.
Innovation Solution
A method and apparatus utilizing drums with selective adhesive regions and adjustable adhesion forces to transfer device chips from a first substrate to a second substrate, allowing for precise alignment and reduced pushing length, thereby improving arrangement accuracy and shortening manufacturing time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a plate-like relay substrate is used to transfer electronic device chips, then the chips can be transferred from the first substrate to the second substrate, but the entire surface of the relay substrate comes into contact with the substrate surface, causing larger pushing length and increased distortion
Solution Approach 1:
The patent divides the contact interface into discrete point contacts through protrusions on the relay substrate rather than continuous surface contact. This segmentation reduces the pushing length from the entire substrate area to just the contact points, thereby minimizing distortion while maintaining transfer capability
Solution Approach 2:
The patent introduces vertical dimension elements (protrusions) to the otherwise planar relay substrate. These protrusions create localized contact points that elevate the chips off the substrate surface during transfer, reducing the pushing length and distortion in the horizontal plane
2Quantity of substance
If the relay substrate is made larger to accommodate more chips, then the transfer capacity increases, but the difference in separating force increases, causing yield degradation due to separation error
Solution Approach 1:
The patent applies local quality by creating regions of different adhesive properties on the relay substrate - protrusions with adhesive layers for chip pickup and non-adhesive regions for easy release. This local differentiation allows uniform separating force across the entire substrate while maintaining high transfer capacity
Solution Approach 2:
The patent prepares the relay substrate in advance with specifically designed protrusions and adhesive layers before chip transfer. This preliminary configuration ensures that when chips are transferred, the separating force is uniformly distributed, preventing separation errors even when transferring large numbers of chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the accuracy and efficiency of transferring device chips, reducing distortion and manufacturing costs while enabling the production of high-resolution display apparatuses, including large-screen displays.
Implementation Method 1
a first take-out step for making at least part of the device chips on the first substrate come into contact with and adhere to at least part of a selective adhesive region on a third adhesive layer of a first drum
Data Source
AI summary
An apparatus includes a first substrate including a first adhesive layer, a second substrate including a second adhesive layer, a first drum that is rotatable, and a third adhesive layer located on the first drum. The first drum moves to a first location to separate device chips from the first adhesive layer of the first substrate and adheres the device chips to the third adhesive layer by rotating the first drum, and moves to a second location to separate the device chips from the third adhesive layer by rotating the first drum. The adhesive force of the first adhesive layer is less than the adhesive force of the third adhesive layer, and the adhesive force of the third adhesive layer is less than the adhesive force of the second adhesive layer.